Silicone Sheet (0.006 inch)
Bare Joint
+
Floroether Oil Sheet (0.007 inch)
Graphite/Oil Sheet (0.005 inch)
Synthetic Grease
2
+
+
1.5
+
1
0.5
0
20
30
40
50
60
70
80
0
10
Contact Pressure (PSI)
Figure 21. Thermal Performance of Select Thermal Interface Material
Th e board design er can ch oose between several types of th erm al in terfaces. Heat sin k
adh esive m aterials sh ou ld be selected based u pon h igh con du ctivity, yet adequ ate
m ech an ical stren gth to m eet equ ipm en t sh ock/ vibration requ irem en ts. Th ere are sev-
eral com m ercially-available th erm al in terfaces an d adh esive m aterials provided by th e
followin g ven dors:
Dow-Corn in g Corporation
Dow-Corn in g Electron ic Materials
P.O. Box 0997
517-496-4000
Midlan d, MI 48686-0997
Ch om erics, In c.
617-935-4850
77 Dragon Cou rt
Wobu rn , MA 01888-4850
PPC740 and PPC750 Hardware Specifications
40 of 44
Preliminary and subject to change without notice
IBM [ IBM ]
