Datasheet
Preliminary
CPC945 Bridge and Memory Controller
Figure 4-2. FC-PBGA Package (Top and Side Views)
Cover Plate
)
(
35.5
37.5
(1)
A
)
(
B
A01 corner
0.25
C
Solderball 4
Cover Plate
0.35
C
Laminate
Sylgard
0.1
E
D
2
H4
A
A
Notes:1 Package conforms to JEDEC SPEC. MS-034. With the exception of note 4.
2 Copper-to-copper thickness.
0.2
C
C
3 In the case where the edge deflection is toward the laminate, the plate flatness is to be less than or
equal to 0.254 mm.
4 Indicated feature does not conform to JEDEC MS-034.
This side
A15-6009-03
December 18, 2007 - IBM Confidential
Dimensions and Pin Information
Page 33 of 69
IBM [ IBM ]
