欢迎访问ic37.com |
会员登录 免费注册
发布采购

IBM25CPC945CQ3C-2 参数 Datasheet PDF下载

IBM25CPC945CQ3C-2图片预览
型号: IBM25CPC945CQ3C-2
PDF下载: 下载PDF文件 查看货源
内容描述: [Micro Peripheral IC, CMOS, PBGA1182,]
分类和应用:
文件页数/大小: 69 页 / 1861 K
品牌: IBM [ IBM ]
 浏览型号IBM25CPC945CQ3C-2的Datasheet PDF文件第27页浏览型号IBM25CPC945CQ3C-2的Datasheet PDF文件第28页浏览型号IBM25CPC945CQ3C-2的Datasheet PDF文件第29页浏览型号IBM25CPC945CQ3C-2的Datasheet PDF文件第30页浏览型号IBM25CPC945CQ3C-2的Datasheet PDF文件第32页浏览型号IBM25CPC945CQ3C-2的Datasheet PDF文件第33页浏览型号IBM25CPC945CQ3C-2的Datasheet PDF文件第34页浏览型号IBM25CPC945CQ3C-2的Datasheet PDF文件第35页  
Datasheet  
Preliminary  
CPC945 Bridge and Memory Controller  
4. Dimensions and Pin Information  
4.1 Package Information  
The CPC945 device is packaged in a flip chip plastic ball grid array (FC-PBGA) incorporating 1182 populated  
package pins on a 36 × 36 ball array. This package has a lead-free C4 and BGA attachment and a 2 mm  
attached heat-spreader lid. The lead-free statement means that none of a product’s homogeneous materials  
contain lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls or polybrominated  
diphenyl ethers in excess of the RoHS directives’ maximum concentration values (as those values existed as  
of March 1, 2006). For further information, see the CPC945 Materials Declaration Form.  
Figure 4-1 on page 32 and Figure 4-2 on page 33 show the dimensions for the FC-PBGA package.  
Figure 4-3 on page 34 identifies the pin types used on this device.  
A15-6009-03  
December 18, 2007 - IBM Confidential  
Dimensions and Pin Information  
Page 31 of 69  
 复制成功!