Datasheet
Preliminary
CPC945 Bridge and Memory Controller
4. Dimensions and Pin Information
4.1 Package Information
The CPC945 device is packaged in a flip chip plastic ball grid array (FC-PBGA) incorporating 1182 populated
package pins on a 36 × 36 ball array. This package has a lead-free C4 and BGA attachment and a 2 mm
attached heat-spreader lid. The lead-free statement means that none of a product’s homogeneous materials
contain lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls or polybrominated
diphenyl ethers in excess of the RoHS directives’ maximum concentration values (as those values existed as
of March 1, 2006). For further information, see the CPC945 Materials Declaration Form.
• Figure 4-1 on page 32 and Figure 4-2 on page 33 show the dimensions for the FC-PBGA package.
• Figure 4-3 on page 34 identifies the pin types used on this device.
A15-6009-03
December 18, 2007 - IBM Confidential
Dimensions and Pin Information
Page 31 of 69
IBM [ IBM ]
