Datasheet
CPC945 Bridge and Memory Controller
Preliminary
3.2 Package Thermal Specifications
Table 3-2. Package Thermal Information
Parameter
Package
Symbol
Value
Junction-to-case thermal resistance
FC-PBGA
θJC
0.383°C/W
3.3 Capacitance
Table 3-3. Input Capacitance
Parameter
Symbol
Maximum
Units
pF
Input capacitance (1.2 V group)
Input capacitance (1.3 V - 1.5 V group)
Input capacitance (1.5 V group)
Input capacitance (1.8 V group)
Input capacitance (2.5 V group)
CIN12
CIN13-15
CIN15
5
6
7
7
6
pF
pF
CIN18
pF
CIN25
pF
Note: These values are not 100% tested or guaranteed. They are provided as guidelines; however, designers are encouraged to model
the high speed interfaces to verify that their applications will work at their required performance level. Models and package impedance
information is available for download from the IBM technical library.
Electrical and Thermal Characteristics
Page 22 of 69
A15-6009-03
December 18, 2007 - IBM Confidential
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