IBM11M4730H
IBM11M4730HB
4M x 72 DRAM MODULE
Absolute Maximum Ratings
Symbol
V
CC
V
IN
V
OUT
T
OPR
T
STG
P
D
I
OUT
I
OUTPD
Parameter
Power Supply Voltage
Input Voltage
Output Voltage
Operating Temperature
Storage Temperature
Power Dissipation
Short Circuit Output Current
Short Circuit Output Current (PD)
Rating (3.3V)
-0.5 to +4.6
-0.5 to min (V
CC
+ 0.5, 4.6)
-0.5 to min (V
CC
+ 0.5, 4.6)
0 to +70
-55 to +125
5.8
50
60
Rating (5.0V)
-1.0 to +7.0
-0.5 to min (V
CC
+ 0.5, 7.0)
-0.5 to min (V
CC
+ 0.5, 7.0)
0 to +70
-55 to +125
8.9
50
60
Units
V
V
V
Notes
1
1
1
1
1
1, 2
1
1
°
C
°
C
W
mA
mA
1. Stresses greater than those listed may cause permanent damage to the device. This is a stress rating only and functional opera-
tion of the device at these or any other conditions above those indicated is not implied. Exposure to absolute maximum rating con-
dition for extended periods may affect reliability.
2. Maximum power occurs when all banks are active (refresh cycle).
Recommended DC Operating Conditions
(T
A
= 0 to 70
°
C)
3.3V
Symbol
V
CC
V
IH
V
IL
Parameter
Supply Voltage
Input High Voltage
Input Low Voltage
Min
3.0
2.0
-0.5
Typ
3.3
—
—
Max
3.6
V
CC
+ 0.5
0.8
Min
4.5
2.4
-0.5
5.0V
Typ
5.0
—
—
Max
5.5
V
CC
+ 0.5
0.8
Units
V
V
V
Notes
1
1. All voltages referenced to V
SS.
2. V
IH
may overshoot to V
CC
+ 1.2V for pulse widths of
≤
4.0ns with 3.3 Volt, or V
CC
+ 2.0V for pulse widths of
≤
4.0ns (or V
CC
+ 1.0V
for
≤
8.0ns) with 5.0 Volt. Additionally, V
IL
may undershoot to -2.0V for pulse widths
≤
4.0ns (or -1.0V for
≤
8.0ns). Pulse widths
measured at 50% points with amplitude measured peak to DC reference.
Capacitance
(T
A
= 0 to +70
°
C, V
CC
= 3.3V
±
0.3V or 5.0V
±
0.5V)
Symbol
C
I1
C
I2
C
I3
C
I4
C
IO1
C
O1
C
O2
Input Capacitance (A0, B0, A1-A10)
RAS0, 1
Input Capacitance (RAS)
RAS2, 3
Input Capacitance (CAS, WE, OE)
Input Capacitance (PDE)
Input/Output Capacitance (DQ
X
)
Output Capacitance (PD)
Output Capacitance (ID)
35
13
18
22
15
5
pF
pF
pF
pF
pF
pF
Parameter
Max
13
40
Units
pF
pF
54H8529
SA14-4637-01
Released 3/96
©IBM Corporation. All rights reserved.
Use is further subject to the provisions at the end of this document.
Page 5 of 26
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