Discontinued (12/98 - last order; 9/99 last ship)
IBM0316409C IBM0316809C IBM0316169C
IBM03164B9C
16Mb Synchronous DRAM-Die Revision D
Operating Currents (T = 0 to +70˚C, V = 3.3V ± 0.3V)
A
DD
Organization
Units Notes
CAS
Speed
Sort
tRC(min)
Symbol
Parameter
Test Condition
Latency
X4
40
X8
X16
tRC = ∞
tCK=30 ns
CL=1
CL=2
-10
-80
45
55
mA
tRC = ∞
tCK=12 ns
90
—
95
75
110
—
tRC = ∞
tCK=15 ns
-360
-10
mA
t
RC = Infinity
CK ≥ tCK(min)
O = 0mA
Operating Current
Burst Length = Full
Page
1, 2, 3,
4
tRC = ∞
tCK=15 ns
ICC9
t
70
75
90
I
tRC = ∞
tCK=8 ns
-80
125
—
130
105
105
85
170
—
tRC = ∞
tCK=10 ns
CL=3
CL=1
CL=2
-360
-10
mA
mA
mA
tRC = ∞
tCK=10 ns
100
85
135
90
tRC = ∞
tCK=30 ns
-10
tRC = ∞
tCK=12ns
-80
165
—
165
130
130
220
175
175
175
—
Operating Current
1-N Rule
tRC = ∞
tCK=15 ns
-360
-10
t
RC = Infinity
tRC = ∞
tCK=15 ns
(Continuous
ICC10
t
CK ≥ tCK(min)
130
220
—
140
240
—
1, 2, 3
Read/Write cycles
with new column
address registered
each clock cycle)
IO = 0mA
tRC = ∞
tCK=8 ns
-80
tRC = ∞
tCK=10 ns
CL=3
-360
-10
mA
tRC = ∞
tCK=10 ns
175
190
1. The specified values are obtained with the output open.
2. The specified values are valid when addresses and DQs are changed no more than once during tCK(min).
3. For stacked devices: this is the active portion only.The total stack current includes the Precharge Standby current of the inactive
deck (Operating Current+ ICC1N).
4. The specified values are obtained when the programmed burst length is executed to completion without interruption by a subse-
quent burst Read or Write cycle.
©IBM Corporation. All rights reserved.
Use is further subject to the provisions at the end of this document.
08J3348.E35853
5/98
Page 47 of 120