Discontinued (12/98 - last order; 9/99 last ship)
IBM0316409C IBM0316809C IBM0316169C
IBM03164B9C
16Mb Synchronous DRAM-Die Revision D
Operating Currents (T = 0 to +70˚C, V = 3.3V ± 0.3V)
A
DD
Organization
X8
CAS
Speed
Sort
tRC(min)
Symbol
Parameter
Test Condition
Units Notes
mA
Latency
X4
95
X16
95
CL=1
CL=2
90 ns
72 ns
-10
-80
95
130
—
130
105
105
155
160
125
75
135
—
90 ns
-360
-10
mA
t
t
RC = tRC(min)
CK ≥ tCK(min)
O = 0mA
Operating Current
Burst Length = 1
ICC5
90 ns
105
155
—
110
160
—
1, 2, 3
I
72 ns
-80
CL=3
CL=1
CL=2
70 ns
-360
-10
mA
mA
90 ns
125
75
130
80
120 ns
84 ns
-10
-80
125
—
125
100
100
155
155
125
65
130
—
105 ns
105 ns
80 ns
-360
-10
mA
t
t
RC = tRC(min)
CK ≥ tCK(min)
O = 0mA
Operating Current
Burst Length = 2
1, 2, 3,
4
ICC6
ICC7
ICC8
100
155
—
105
160
—
I
-80
CL=3
CL=1
CL=2
80 ns
-360
-10
mA
mA
100 ns
180 ns
108 ns
135 ns
135 ns
96 ns
125
65
130
70
-10
-80
115
—
120
95
125
—
-360
-10
mA
t
t
RC = tRC(min)
CK ≥ tCK(min)
O = 0mA
Operating Current
Burst Length = 4
1, 2, 3,
4
90
95
100
160
—
I
-80
150
—
155
150
125
60
CL=3
CL=1
CL=2
100 ns
120 ns
300 ns
156 ns
195 ns
195 ns
128 ns
140 ns
160 ns
-360
-10
mA
mA
120
55
130
65
-10
-80
105
—
110
90
120
—
-360
-10
mA
t
t
RC = tRC(min)
CK ≥ tCK(min)
O = 0mA
Operating Current
Burst Length = 8
1, 2, 3,
4
85
90
100
165
—
I
-80
150
—
155
145
125
CL=3
-360
-10
mA
120
135
1. The specified values are obtained with the output open.
2. The specified values are valid when addresses and DQs are changed no more than once during tCK(min).
3. For stacked devices: this is the active portion only.The total stack current includes the Precharge Standby current of the inactive
deck (Operating Current+ ICC1N).
4. The specified values are obtained when the programmed burst length is executed to completion without interruption by a subse-
quent burst Read or Write cycle.
©IBM Corporation. All rights reserved.
Use is further subject to the provisions at the end of this document.
08J3348.E35853
5/98
Page 46 of 120
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