Package Description
18 Package Description
This section details package parameters, pin assignments, and dimensions.
18.1
Package Parameters
The package parameters for both the HiCTE FC-CBGA and FC-PBGA are as provided in
Table 66. Package Parameters
Parameter
Package outline
Interconnects
Ball pitch
Ball diameter (typical)
Solder ball
CBGA
1
29 mm
×
29 mm
783
1 mm
0.6 mm
62% Sn
36% Pb
2% Ag
95% Sn
4.5% Ag
0.5% Cu
PBGA
2
29 mm
×
29 mm
783
1 mm
0.6 mm
62% Sn
36% Pb
2% Ag
96.5% Sn
3.5% Ag
Solder ball (lead-free)
Notes:
1. The HiCTE FC-CBGA package is available on only Version 2.0 of the device.
2. The FC-PBGA package is available on only Version 2.1.1 and 2.1.2 of the
device.
MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6
Freescale Semiconductor
87