Package Description
18 Package Description
This section details package parameters, pin assignments, and dimensions.
18.1 Package Parameters
The package parameters for both the HiCTE FC-CBGA and FC-PBGA are as provided in Table 66.
Table 66. Package Parameters
1
2
Parameter
Package outline
CBGA
PBGA
29 mm × 29 mm
783
29 mm × 29 mm
783
Interconnects
Ball pitch
1 mm
1 mm
Ball diameter (typical)
Solder ball
0.6 mm
0.6 mm
62% Sn
36% Pb
2% Ag
62% Sn
36% Pb
2% Ag
Solder ball (lead-free)
95% Sn
4.5% Ag
0.5% Cu
96.5% Sn
3.5% Ag
Notes:
1. The HiCTE FC-CBGA package is available on only Version 2.0 of the device.
2. The FC-PBGA package is available on only Version 2.1.1 and 2.1.2 of the
device.
MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6
Freescale Semiconductor
87
FREESCALE [ Freescale ]
