Package Description
18.2
Mechanical Dimensions of the HiCTE FC-CBGA and FC-PBGA
with Full Lid
shows the mechanical dimensions and bottom surface nomenclature for both the MPC8548E
HiCTE FC-CBGA and FC-PBGA package with full lid.
Notes:
1. All d
imensions are in millimeters.
2. Dimensioning and tolerancing per ASME Y14.5M-1994.
3. Maximum solder ball diameter measured parallel to datum A.
4. Datum A, the seating plane, is determined by the spherical crowns of the solder balls.
5. Parallelism measurement shall exclude any effect of mark on top surface of package.
6. All dimensions are symmetric across the package center lines unless dimensioned otherwise.
7. Package code summary:
•PBGA 8423
•CBGA 5112
Figure 55. Mechanical Dimensions and Bottom Surface Nomenclature of the HiCTE
FC-CBGA and FC-PBGA with Full Lid
MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6
88
Freescale Semiconductor
FREESCALE [ FREESCALE SEMICONDUCTOR, INC ]
