欢迎访问ic37.com |
会员登录 免费注册
发布采购

MPC8572ELVTAULD 参数 Datasheet PDF下载

MPC8572ELVTAULD图片预览
型号: MPC8572ELVTAULD
PDF下载: 下载PDF文件 查看货源
内容描述: MPC8572E的PowerQUICC III集成处理器硬件规格 [MPC8572E PowerQUICC III Integrated Processor Hardware Specifications]
分类和应用: PC
文件页数/大小: 140 页 / 1412 K
品牌: FREESCALE [ Freescale ]
 浏览型号MPC8572ELVTAULD的Datasheet PDF文件第118页浏览型号MPC8572ELVTAULD的Datasheet PDF文件第119页浏览型号MPC8572ELVTAULD的Datasheet PDF文件第120页浏览型号MPC8572ELVTAULD的Datasheet PDF文件第121页浏览型号MPC8572ELVTAULD的Datasheet PDF文件第123页浏览型号MPC8572ELVTAULD的Datasheet PDF文件第124页浏览型号MPC8572ELVTAULD的Datasheet PDF文件第125页浏览型号MPC8572ELVTAULD的Datasheet PDF文件第126页  
Thermal  
19.5.2 Minimum Platform Frequency Requirements for High-Speed  
Interfaces  
Section 4.4.3.6 “I/O Port Selection” of the MPC8572E PowerQUICC™ III Integrated Host Processor  
Family Reference Manual, describes various high-speed interface configuration options. Note that the  
CCB clock frequency must be considered for proper operation of such interfaces as described below.  
For proper PCI Express operation, the CCB clock frequency must be greater than or equal to:  
527 MHz × (PCI Express link width)  
----------------------------------------------------------------------------------------------  
8
See Section 21.1.3.2, “Link Width” of the MPC8572E PowerQUICC™ III Integrated Host Processor  
Family Reference Manual, for PCI Express interface width details. Note that the “PCI Express link width”  
in the above equation refers to the negotiated link width as the result of PCI Express link training, which  
may or may not be the same as the link width POR selection.  
For proper serial RapidIO operation, the CCB clock frequency must be greater than:  
2 × (0.80) × (serial RapidIO interface frequency) × (serial RapidIO link width)  
-----------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------  
64  
See Section 20.4, “1x/4x LP-Serial Signal Descriptions” of the MPC8572E PowerQUICC™ III Integrated  
Host Processor Family Reference Manual, for serial RapidIO interface width and frequency details.  
20 Thermal  
This section describes the preliminary thermal specifications of the MPC8572E. This is subject to change.  
Table 83 shows the thermal characteristics for the package, 1023 33x33 FC-PBGA.  
The package uses a 29.6 x 29.6 mm lid that attaches to the substrate. Recommended maximum heat sink  
force is 10 pounds force (45 Newton).  
Table 83. Package Thermal Characteristics  
Rating  
Board  
Symbol  
Value  
Unit  
Notes  
Junction to ambient, natural convection  
Junction to ambient, natural convection  
Junction to ambient (at 200 ft./min.)  
Junction to ambient (ar 200 ft./min.)  
Junction to board  
Single-layer (1s)  
Four-layer (2s2p)  
Single-layer (1s)  
Four-layer (2s2p)  
R
15  
11  
11  
8
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
1, 2  
1, 3  
1, 3  
1, 3  
4
ΘJA  
R
ΘJA  
R
ΘJMA  
R
ΘJMA  
R
4
ΘJB  
MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 4  
Freescale Semiconductor  
122