Ethernet: Three-Speed Ethernet, MII Management
8.1.1
TSEC DC Electrical Characteristics
GMII, MII, TBI, RGMII, and RTBI drivers and receivers comply with the DC parametric attributes
specified in Table 23 and Table 24. The RGMII and RTBI signals in Table 24 are based on a 2.5-V CMOS
interface voltage as defined by JEDEC EIA/JESD8-5.
Table 23. GMII/TBI and MII DC Electrical Characteristics
Parameter
Symbol
Conditions
Min
Max
Unit
2
Supply voltage 3.3 V
Output high voltage
Output low voltage
Input high voltage
Input low voltage
Input high current
Input low current
Notes:
LVDD
—
2.97
2.40
GND
2.0
3.63
LVDD + 0.3
0.50
V
V
VOH
VOL
VIH
VIL
IIH
IOH = –4.0 mA
LVDD = Min
IOL = 4.0 mA
LVDD = Min
V
—
—
—
—
LVDD + 0.3
0.90
V
–0.3
—
V
VIN1 = LVDD
VIN1 = GND
40
μA
μA
IIL
–600
—
1. The symbol VIN, in this case, represents the LVIN symbol referenced in Table 1 and Table 2.
2. GMII/MII pins not needed for RGMII or RTBI operation are powered by the OVDD supply.
Table 24. RGMII/RTBI (When Operating at 2.5 V) DC Electrical Characteristics
Parameters
Supply voltage 2.5 V
Symbol
Conditions
Min
Max
Unit
LVDD
VOH
VOL
VIH
VIL
—
2.37
2.00
2.63
LVDD + 0.3
0.40
V
V
Output high voltage
Output low voltage
Input high voltage
Input low voltage
Input high current
Input low current
Note:
IOH = –1.0 mA
LVDD = Min
LVDD = Min
LVDD = Min
LVDD = Min
IOL = 1.0 mA
GND – 0.3
1.7
V
—
—
LVDD + 0.3
0.70
V
–0.3
V
IIH
VIN1 = LVDD
VIN1 = GND
—
10
μA
μA
IIL
–15
—
1. The symbol VIN, in this case, represents the LVIN symbol referenced in Table 1 and Table 2.
8.2
GMII, MII, TBI, RGMII, and RTBI AC Timing Specifications
The AC timing specifications for GMII, MII, TBI, RGMII, and RTBI are presented in this section.
8.2.1
GMII Timing Specifications
This section describes the GMII transmit and receive AC timing specifications.
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
24
Freescale Semiconductor