Package and Pin Listings
18.2 Mechanical Dimensions for the MPC8349EA TBGA
Figure 40 shows the mechanical dimensions and bottom surface nomenclature for the MPC8349EA,
672-TBGA package.
Notes:
1. All dimensions are in millimeters.
2. Dimensions and tolerances per ASME Y14.5M-1994.
3. Maximum solder ball diameter measured parallel to datum A.
4. Datum A, the seating plane, is determined by the spherical crowns of the solder balls.
5. Parallelism measurement must exclude any effect of mark on top surface of package.
Figure 40. Mechanical Dimensions and Bottom Surface Nomenclature for the MPC8349EA TBGA
MPC8349EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 13
Freescale Semiconductor
55
FREESCALE [ Freescale ]
