Physical Dimensions
13.00
12.60
A
11.43
20
11
B
9.50
10.65 7.60
10.00 7.40
2.25
1
PIN ONE
INDICATOR
10
0.65
0.51
0.35
1.27
1.27
M
0.25
C B A
LAND PATTERN RECOMMENDATION
SEE DETAIL A
2.65 MAX
0.33
0.20
C
0.10
C
0.30
0.10
SEATING PLANE
0.75
0.25
X 45°
NOTES: UNLESS OTHERWISE SPECIFIED
(R0.10)
(R0.10)
A) THIS PACKAGE CONFORMS TO JEDEC
MS-013, VARIATION AC, ISSUE E
GAGE PLANE
B) ALL DIMENSIONS ARE IN MILLIMETERS.
C) DIMENSIONS DO NOT INCLUDE MOLD
FLASH OR BURRS.
0.25
8°
0°
D) CONFORMS TO ASME Y14.5M-1994
1.27
0.40
SEATING PLANE
E) LANDPATTERN STANDARD: SOIC127P1030X265-20L
F) DRAWING FILENAME: MKT-M20BREV3
(1.40)
DETAIL A
SCALE: 2:1
Figure 58. 20-SOIC Package
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
© 2007 Fairchild Semiconductor Corporation
FAN7317 • 1.0.2
www.fairchildsemi.com
22
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