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M14D5121632A-2.5BIG2H 参数 Datasheet PDF下载

M14D5121632A-2.5BIG2H图片预览
型号: M14D5121632A-2.5BIG2H
PDF下载: 下载PDF文件 查看货源
内容描述: [DDR DRAM, 32MX16, 0.4ns, CMOS, PBGA84, 8 X 12.50 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, BGA-84]
分类和应用: 动态存储器双倍数据速率内存集成电路
文件页数/大小: 62 页 / 1001 K
品牌: ESMT [ ELITE SEMICONDUCTOR MEMORY TECHNOLOGY INC. ]
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ESMT  
M14D5121632A (2H)  
Operation Temperature Condition (TC) -40°C~95°C  
Mode Register Definition  
Mode Register Set [MRS]  
The mode register stores the data for controlling the various operating modes of DDR2 SDRAM. It programs CAS latency, burst  
length, burst type, test mode, DLL reset, WR and various vendor specific options to make the device useful for variety of different  
applications. The default value of the mode register is not defined, therefore the mode register must be written after Power-Up for  
proper operation. The mode register is written by asserting LOW on CS , RAS , CAS , WE , BA0 and BA1 (The device should  
be in all bank Precharge with CKE already high prior to writing into the mode register). The state of address pins A0~A12 in the  
same cycle as CS , RAS , CAS , WE , BA0 and BA1 going LOW are written in the mode register.  
The tMRD time is required to complete the write operation to the mode register. The mode register contents can be changed using  
the same command and clock cycle requirements during normal operation as long as all banks are in the idle state. The mode  
register is divided into various fields depending on functionality. The burst length is defined by A0 ~ A2. Burst address sequence  
type is defined by A3, CAS latency (read latency from column address) is defined by A4 ~ A6. The DDR2 doesn’t support half clock  
latency mode. A7 is used for test mode. A8 is used for DLL reset. A7 must be set to low for normal MRS operation. Write recovery  
time WR is defined by A9 ~ A11. Refer to the table for specific codes.  
BA1 BA0  
A12  
PD  
A11 A10 A9  
A8  
A7  
A6  
A5  
A4  
A3  
BT  
A2  
A1  
A0  
Address Bus  
Mode Register  
0
0
WR  
DLL TM  
Burst Length  
CAS Latency  
Active Power down exit timing  
A7  
Mode  
A3 Burst Type  
A12  
PD  
0
1
No  
Yes  
0
1
Sequential  
Interleave  
0
1
Fast Exit (normal)  
Slow Exit (low power)  
A8  
DLL reset  
BA1 BA0  
Mode Register  
A2 A1 A0  
Burst Length  
0
1
No  
Yes  
0
0
1
1
0
1
0
1
MRS  
EMRS(1)  
EMRS(2)  
EMRS(3) : Reserved  
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
Reserved  
Reserved  
4
8
Reserved  
Reserved  
Reserved  
Reserved  
CAS Latency  
A6 A5 A4  
Write recovery for Auto Precharge  
Latency  
A11 A10 A9  
WR(cycles)*1  
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
Reserved  
Reserved  
Reserved  
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
Reserved  
2
3
4
5
6
7
8
3
4
5
6
7
Note:  
1. WR(min.) (write recovery for Auto Precharge) is determined by tCK (max.) and WR(max.) is determined by tCK (min.)  
WR in clock cycles is calculated by dividing tWR (in ns) by tCK (in ns) and rounding up a non-integer value to the next  
integer ( WR[cycles] = tWR (ns)/ tCK (ns)). The mode register must be programmed to this value. This is also used with  
t
RP to determine tDAL.  
Elite Semiconductor Memory Technology Inc.  
Publication Date : Aug. 2011  
Revision : 1.1 26/62  
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