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EDE1108AFBG-8G-F 参数 Datasheet PDF下载

EDE1108AFBG-8G-F图片预览
型号: EDE1108AFBG-8G-F
PDF下载: 下载PDF文件 查看货源
内容描述: 1G位DDR2 SDRAM [1G bits DDR2 SDRAM]
分类和应用: 存储内存集成电路动态存储器双倍数据速率
文件页数/大小: 78 页 / 734 K
品牌: ELPIDA [ ELPIDA MEMORY ]
 浏览型号EDE1108AFBG-8G-F的Datasheet PDF文件第10页浏览型号EDE1108AFBG-8G-F的Datasheet PDF文件第11页浏览型号EDE1108AFBG-8G-F的Datasheet PDF文件第12页浏览型号EDE1108AFBG-8G-F的Datasheet PDF文件第13页浏览型号EDE1108AFBG-8G-F的Datasheet PDF文件第15页浏览型号EDE1108AFBG-8G-F的Datasheet PDF文件第16页浏览型号EDE1108AFBG-8G-F的Datasheet PDF文件第17页浏览型号EDE1108AFBG-8G-F的Datasheet PDF文件第18页  
EDE1108AFBG  
AC Characteristics (TC = 0°C to +85°C, VDD, VDDQ = 1.8V ± 0.1V, VSS, VSSQ = 0V) [DDR2-800, 667]  
New units tCK(avg) and nCK, are introduced in DDR2-800 and DDR2-667  
tCK(avg): actual tCK(avg) of the input clock under operation.  
nCK: one clock cycle of the input clock, counting the actual clock edges.  
-8E  
-8G  
-6E  
Speed bin  
Parameter  
DDR2-800 (5-5-5)  
DDR2-800 (6-6-6)  
DDR2-667 (5-5-5)  
Symbol  
tRCD  
tRP  
min.  
12.5  
12.5  
57.5  
max.  
min.  
15  
max.  
min.  
15  
max.  
Unit  
ns  
Notes  
Active to read or write  
command delay  
Precharge command period  
15  
15  
ns  
Active to active/auto-refresh  
command time  
tRC  
60  
60  
ns  
DQ output access time from  
CK, /CK  
tAC  
400  
350  
+400  
+350  
400  
350  
+400  
+350  
450  
400  
+450  
+400  
ps  
ps  
10  
10  
DQS output access time from  
CK, /CK  
tDQSCK  
CK high-level width  
CK low-level width  
tCH (avg) 0.48  
0.52  
0.52  
0.48  
0.48  
0.52  
0.52  
0.48  
0.48  
0.52  
0.52  
tCK (avg) 13  
tCK (avg) 13  
tCL(avg)  
0.48  
Min.  
Min.  
Min.  
CK half period  
tHP  
(tCL(abs),  
tCH(abs))  
(tCL(abs),  
tCH(abs))  
(tCL(abs),  
tCH(abs))  
ps  
ps  
6, 13  
Clock cycle time  
(CL = 6)  
tCK (avg) 2500  
8000  
2500  
8000  
3000  
8000  
13  
(CL = 5)  
tCK (avg) 2500  
tCK (avg) 3750  
tCK (avg) 5000  
tDH (base) 125  
tDS (base) 50  
8000  
8000  
8000  
3000  
3750  
5000  
125  
8000  
8000  
8000  
3000  
3750  
5000  
175  
8000  
8000  
8000  
ps  
ps  
ps  
ps  
ps  
13  
13  
13  
5
(CL = 4)  
(CL = 3)  
DQ and DM input hold time  
DQ and DM input setup time  
50  
100  
4
Control and Address input  
pulse width for each input  
tIPW  
tDIPW  
tHZ  
0.6  
0.6  
0.6  
tCK (avg)  
tCK (avg)  
DQ and DM input pulse width  
for each input  
0.35  
0.35  
0.35  
Data-out high-impedance time  
from CK,/CK  
tAC max.  
tAC max.  
tAC max. ps  
10  
10  
10  
DQS, /DQS low-impedance  
time from CK,/CK  
tLZ (DQS) tAC min. tAC max. tAC min. tAC max. tAC min. tAC max. ps  
DQ low-impedance time from  
CK,/CK  
2 ×  
2 ×  
2 ×  
tLZ (DQ)  
tAC max.  
tAC max.  
tAC max. ps  
tAC min.  
tAC min.  
tAC min.  
DQS-DQ skew for DQS and  
associated DQ signals  
tDQSQ  
tQHS  
tQH  
200  
300  
200  
300  
240  
340  
ps  
ps  
ps  
DQ hold skew factor  
7
8
DQ/DQS output hold time from  
DQS  
tHP –  
tQHS  
tHP –  
tQHS  
tHP –  
tQHS  
DQS latching rising transitions  
to associated clock edges  
tDQSS  
0.25  
+0.25  
0.25  
+0.25  
0.25  
+0.25  
tCK (avg)  
DQS input high pulse width  
DQS input low pulse width  
tDQSH  
tDQSL  
0.35  
0.35  
0.35  
0.35  
0.35  
0.35  
tCK (avg)  
tCK (avg)  
DQS falling edge to CK setup  
time  
tDSS  
tDSH  
0.2  
0.2  
0.2  
0.2  
0.2  
0.2  
tCK (avg)  
tCK (avg)  
DQS falling edge hold time  
from CK  
Mode register set command  
cycle time  
tMRD  
2
2
2
nCK  
Write postamble  
tWPST  
0.4  
0.6  
0.4  
0.6  
0.4  
0.6  
tCK (avg)  
Preliminary Data Sheet E1430E20 (Ver. 2.0)  
14  
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