EDJ2108EEBG, EDJ2116EEBG
Table 6: Basic IDD and IDDQ Measurement Conditions (cont’d)
Parameter
Symbol
Description
CKE: H; External clock: on; tCK, CL: see Table 5; BL: 8*1; AL: 0; /CS: H between WR;
command, address, bank address inputs: partially toggling according to Table 12;
data I/O: seamless write data burst with different data between one burst and the next
one according to IDD4W Measurement-Loop Pattern table; DM: stable at 0; bank
activity: all banks open,
Operating burst write current IDD4W
WR commands cycling through banks: 0,0,1,1,2,2,.. (see Table 12); Output buffer
and RTT: enabled in MR*2; ODT signal: stable
at H; pattern details: see Table 12
CKE: H; External clock: on; tCK, CL, nRFC: see Table 5; BL: 8*1; AL: 0; /CS: H
between REF;
Command, address, bank address Inputs: partially toggling according to Table 13;
data I/O: MID-LEVEL; DM: stable at 0;
Burst refresh current
IDD5B
IDD6
bank activity: REF command every nRFC (Table 13); output buffer and RTT: enabled
in MR*2; ODT signal: stable at 0; pattern
details: see Table 13
TC: 0 to 85°C; ASR: disabled*4; SRT:
Normal*5; CKE: L; External clock: off; CK and /CK: L; CL: see Table 5; BL: 8*1;
AL: 0; /CS, command, address, bank address, data I/O: MID-LEVEL; DM: stable
at 0; bank activity: Self-refresh operation; output buffer and RTT: enabled in MR*2;
ODT signal: MID-LEVEL
Self-refresh current: normal
temperature range
TC: 0 to 95°C; ASR: Disabled*4; SRT: Extended*5; CKE: L; External clock: off; CK
and /CK: L; CL: Table 5; BL: 8*1; AL: 0; /CS, command, address, bank address, data
I/O: MID-LEVEL;
Self-refresh current: extended
temperature range
IDD6ET
IDD6TC
DM: stable at 0; bank activity: Extended temperature self-refresh operation; output
buffer and RTT: enabled in MR*2; ODT signal: MID-LEVEL
TC: 0 to 95°C; ASR: Enabled*4; SRT: Normal*5; CKE: L; External clock: off;
CK and /CK: L; CL: Table 5; BL: 8*1; AL: 0; /CS, command, address, bank address,
data I/O: MID-LEVEL; DM: stable at 0; bank activity: Auto self-refresh operation;
output buffer and RTT: enabled in MR*2; ODT signal: MID-LEVEL
Auto self-refresh current
(Optional)
CKE: H; External clock: on; tCK, nRC, nRAS, nRCD, nRRD, nFAW, CL: see Table 5;
BL: 8*1, *6; AL: CL-1; /CS: H between ACT and RDA; Command, address, bank
address Inputs: partially toggling according to Table 14; data I/O: read data bursts
with different data between one burst and the next one according to Table 14; DM:
stable at 0; bank activity: two times interleaved cycling through banks (0, 1, …7) with
different addressing, see Table 14; output buffer and RTT: enabled in MR*2; ODT
signal: stable at 0; pattern details: see Table 14
Operating bank interleave
read current
IDD7
IDD8
/RESET: low; External clock: off; CK and /CK: low; CKE: FLOATING; /CS, command,
address, bank address, Data IO: FLOATING; ODT signal: FLOATING
RESET low current reading is valid once power is stable and /RESET has been low
for at least 1ms.
RESET low current
Notes: 1. Burst Length: BL8 fixed by MRS: MR0 bits [1,0] = [0,0].
2. MR: Mode Register
Output buffer enable: set MR1 bit A12 = 1 and MR1 bits [5, 1] = [0,1];
RTT_Nom enable: set MR1 bits [9, 6, 2] = [0, 1, 1]; RTT_WR enable: set MR2 bits [10, 9] = [1,0].
3. Precharge power down mode: set MR0 bit A12= 0 for Slow Exit or MR0 bit A12 = 1 for fast exit.
4. Auto self-refresh (ASR): set MR2 bit A6 = 0 to disable or 1 to enable feature.
5. Self-refresh temperature range (SRT): set MR0 bit A7= 0 for normal or 1 for extended temperature range.
6. Read burst type: nibble sequential, set MR0 bit A3 = 0
Data Sheet E1750E31 (Ver. 3.1)
12
ELPIDA [ ELPIDA MEMORY ]
