Table 8: DEI1116/DEI1117 Ordering Information
DEI PART NUMBER (2)
MARKING (1)
REQUIRES EXT PACKAGE TEMP RANGE
DIxx 10K RES
PROCESSING (3)
DEI1116-QES-G
DEI1116-QMS-G
DEI1116-PMS-G
DEI1116-PES-G
DEI1117-QES-G
DEI1117-QMS-G
DEI1117-PMS-G
DEI1117-PES-G
Notes:
DEI1116-QES e3
DEI1116-QMS e3
DEI1116-PMS e3
DEI1116-PES e3
DEI1117-QES e3
DEI1117-QMS e3
DEI1117-PMS e3
DEI1117-PES e3
No
No
44 PQFP G
44 PQFP G
44 PLCC G
44 PLCC G
44 PQFP G
44 PQFP G
44 PLCC G
44 PLCC G
-55 / +85 °C
-55 / +125 °C
-55 / +125 °C
-55 / +85 °C
-55 / +85 °C
-55 / +125 °C
-55 / +125 °C
-55 / +85 °C
PLASTIC STANDARD
PLASTIC STANDARD
PLASTIC STANDARD
PLASTIC STANDARD
PLASTIC STANDARD
PLASTIC STANDARD
PLASTIC STANDARD
PLASTIC STANDARD
No
No
Yes
Yes
Yes
Yes
1. All packages marked with Lot Code and Date Code. “e3” or “e4” after Date Code denotes Pb Free category.
2. Suffix legend: -XYZ-G: X = package code, Y = temperature range code, Z = process flow code, -G = Green (Pb Free)
3. Contact factory for screening method of other packages
Table 9: Screening Process
Other Packages
PLASTIC STANDARD
-xxS
WAFER PROBE
Room Temp
THERMAL CYCLE -MIL-STD-883B M1010.4 Condition B
GROSS & FINE LEAK
NO
NO
NO
BURN IN -MIL-STD-883B M1015 Condition A
ELECTRICAL TEST
100%
ROOM TEMPERATURE
ELECTRICAL TEST
100% +125°C (-xMx)
100% +85°C (-xEx)
HIGH TEMPERATURE
ELECTRICAL TEST
0.65% AOQL @-55°C
LOW TEMPERATURE
Note: AOQL samples use a Zero Acceptance Number sampling plan per AS9100
Table 10: Package Characteristics
JEDEC
LEAD FINISH
THERMAL
RESIST
MOISTURE
SENSITIVITY
LEVEL
MATERIAL /
JEDEC
PACKAGE
REF
Pb Free
PACKAGE TYPE
JEDEC MO
θJC / θJA
(ºC/W)
DESIGNATION
Pb-Free
CODE
Matte Sn
e3
Matte Sn
e3
& PEAK
BODY TEMP
MSL 3
44L PLASTIC QUAD
FLAT PACK, GREEN
44L PLASTIC CHIP
CARRIER, GREEN
44 PQFP G
44 PLCC G
21/65
21/46
RoHS Compliant M0-112-AA-1
RoHS Compliant MS-018-AC
260ºC
MSL 3
245ºC
© 2012 Device Engineering Inc.
DS-MW-01117-01 Rev B
02/09/2012
Page 13 of 14
DEIAZ [ Device Engineering Incorporated ]
