CY62256N
Thermal Resistance[5]
Parameter
Description
Test Conditions
DIP
SOIC
TSOP
RTSOP
Unit
ΘJA
Thermal Resistance
(Junction to Ambient)
Still Air, soldered on a 4.25 x 1.125 75.61
inch, 4-layer printed circuit board
76.56
93.89
93.89
°C/W
ΘJC
Thermal Resistance
(Junction to Case)
43.12
36.07
24.64
24.64
°C/W
AC Test Loads and Waveforms
R1 1800Ω
R1 1800Ω
5V
5V
OUTPUT
ALL INPUT PULSES
90%
OUTPUT
3.0V
90%
10%
10%
R2
990Ω
R2
990Ω
100 pF
5 pF
GND
< 5 ns
< 5 ns
INCLUDING
JIG AND
SCOPE
INCLUDING
JIG AND
SCOPE
(a)
(b)
Equivalent to:
THÉVENIN EQUIVALENT
639Ω
OUTPUT
1.77V
Data Retention Characteristics
Parameter
VDR
Description
VCC for Data Retention
Data Retention Current
Conditions[6]
Min.
Typ.[2]
Max.
Unit
V
2.0
ICCDR
L
VCC = 2.0V, CE > VCC − 0.3V,
VIN > VCC − 0.3V, or VIN < 0.3V
2
50
5
µA
µA
µA
µA
ns
LL-Comm’l
0.1
0.1
0.1
LL - Ind’l/Auto-A
LL - Auto-E
10
10
[8]
tCDR
Chip Deselect to Data Retention Time
Operation Recovery Time
0
[8]
tR
tRC
ns
Data Retention Waveform
DATA RETENTION MODE
3.0V
3.0V
V
DR
> 2V
V
CC
t
t
R
CDR
CE
Note:
6. No input may exceed V + 0.5V.
CC
Document #: 001-06511 Rev. *A
Page 4 of 13
[+] Feedback
CYPRESS [ CYPRESS ]
