CY62187EV30 MoBL®
Package Diagram
Figure 10. 48-ball FBGA (8 × 9.5 × 1.4 mm)
001-50044 *C
Acronyms
Document Conventions
Units of Measure
Acronym
Description
byte high enable
byte low enable
BHE
BLE
CMOS
CE
Symbol
Unit of Measure
°C
MHz
µA
mA
ms
ns
degree Celsius
Mega Hertz
complementary metal oxide semiconductor
chip enable
micro Amperes
milli Amperes
milli seconds
nano seconds
ohms
I/O
input/output
OE
output enable
SRAM
FBGA
WE
static random access memory
fine-pitch ball grid array
write enable
%
percent
pF
V
pico Farads
Volts
W
Watts
Document Number: 001-48998 Rev. *E
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