Huajing Discrete Devices
R
○
The name and content of poisonous and harmful material in products
Hazardous Substance
Part’s Name
Pb
Hg
Cd
Cr(VI)
PBB
PBDE
≤0.1%
≤0.1%
≤0.01%
≤0.1%
≤0.1%
≤0.1%
Limit
Lead Frame
Molding Compound
Chip
○
○
○
○
×
○
○
○
○
○
○
○
○
○
○
○
○
○
○
○
○
○
○
○
○
○
○
○
○
○
Wire Bonding
Solder
○：means the hazardous material is under the criterion of SJ/T11363-2006.
×：means the hazardous material exceeds the criterion of SJ/T11363-2006.
Note
Warnings
1. Exceeding the maximun ratings of the device in performance may cause damage to the device,
even the permanent failure, which may affect the dependability of the machine. It is suggested
to be used under 80 percent of the maximun ratings of the device.
2. When installing the heatsink, please pay attention to the torsional moment and the smoothness
of the heatsink.
3. VDMOSFETs is the device which is sensitive to the static electricity, it is necessory to protect
the device from being damaged by the static electricity when using it.
4. This publication is made by Huajing Microelectronics and subject to regular change without
notice.
：
http://www.wimtel.com
Marketing Part
Tel: 0755-82389111 Fax: 0755-33065120
WUXI CHINA RESOURCES HUAJING MICROELECTRONICS CO., LTD. Page 10 of 10
2011
CONSONANCE [ Shanghai Consonance Electronics Incorporated ]
