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AS4SD4M16DG-10/XT 参数 Datasheet PDF下载

AS4SD4M16DG-10/XT图片预览
型号: AS4SD4M16DG-10/XT
PDF下载: 下载PDF文件 查看货源
内容描述: 4梅格×16 SDRAM同步动态随机存取存储 [4 Meg x 16 SDRAM Synchronous DRAM Memory]
分类和应用: 存储内存集成电路光电二极管动态存储器时钟
文件页数/大小: 50 页 / 1139 K
品牌: AUSTIN [ AUSTIN SEMICONDUCTOR ]
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SDRAM  
AS4SD4M16  
Austin Semiconductor, Inc.  
CONCURRENT AUTO PRECHARGE  
READ with AUTO PRECHARGE  
1. Interrupted by a READ (with or without AUTO  
PRECHARGE): A READ to bank m will interrupt a READ  
on bank n, CAS latency later. The PRECHARGE to bank n  
will begin when the READ to bank m is registered  
(Figure 24).  
2. Interrupted by a WRITE (with or without AUTO  
PRECHARGE): A WRITE to bank m will interrupt a READ  
on bank n when registered. DQM should be used two  
clocks prir to the WRITE command to prevent bus  
contention. The PRECHARGE to bank n will begin when  
the WRITE to bank m is registered (Figure 25).  
An access command (READ or WRITE) to another  
bank while an access command with AUTO PRECHARGE en-  
abled is executing is not allowed by SDRAMs, unless the  
SDRAM supports CONCURRENT AUTO PRECHARGE. ASI  
SDRAMs support CONCURRENT AUTO PRECHARGE. Four  
cases where CONCURRENT AUTO PRECHARGE occurs are  
defined below.  
T7  
T6  
T0  
T1  
T2  
T3  
T4  
T5  
CLK  
READ-AP  
BANK n  
READ-AP  
BANK m  
COMMAND  
NOP  
NOP  
NOP  
NOP  
Idle  
NOP  
NOP  
BANK n  
Internal  
States  
Page Active  
READ with burst of 4  
Interrupt Burst, Precharge  
tRP-BANK m  
tRP - BANK n  
Page Active  
Precharge  
BANK m  
READ with burst of 4  
BANK n,  
COL a  
BANK m,  
COL d  
ADDRESS  
DQ  
DOUT  
a
DOUT a+1  
DOUT d+1  
DOUT  
d
CAS Latency = 3 (BANK n)  
NOTE: DQM is LOW.  
CAS Latency = 3 (BANK m)  
Figure 24  
READ WITH AUTO PRECHARGE INTERRUPTED BY A READ  
T7  
T0  
T1  
T2  
T3  
T4  
T5  
T6  
CLK  
READ-AP  
BANK n  
WRITE-AP  
BANKm  
NOP  
NOP  
COMMAND  
NOP  
NOP  
Idle  
NOP  
NOP  
Page  
Active  
BANK n  
Internal  
States  
READ with burst of 4  
Interrupt Burst, Precharge  
tRP - BANK n  
tWR-BANKm  
Write back  
Page Active  
BANK m  
WRITE with burst of 4  
BANK n,  
COL a  
BANK m,  
COL d  
ADDRESS  
DQM1  
D
d+1  
D
d+2  
D
d+3  
IN  
IN  
IN  
DOUT  
a
DIN  
d
DQ  
CAS Latency = 3 (BANK n)  
Don’t Care  
NOTE: 1. DQM is HIGH at T2 to prevent DOUT-a+1 from contending with DIN-d at T4.  
Figure 25  
READ WITH AUTO PRECHARGE INTERRUPTED BY A WRITE  
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.  
AS4SD4M16  
Rev. 1.5 10/01  
23  
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