Revision NC - Oct 17, 2001
S3098 – SONET/SDH/ATM OC-192 1:16
Low Power Receiver w/CDR/Postamp
DEVICE SPECIFICATION
Table 6. Common Pin Descriptions and Assignment
Pin Name
Level
I/O
Pin #
B8, C13, M2, M8, M9
Description
COREVCC
+2.5 V
PWR
Digital V
+ 2.5 V ± 5%
+ 2.5 V ± 5%
CC_2.5 V
LVDS V
CC_2.5 V
LVDSVCC
LVCMOSVCC
CMLVEE
+2.5 V
+2.5 V
-5.2 V
-5.2 V
+3.3 V
+3.3 V
0 V
PWR
PWR
PWR
PWR
PWR
PWR
GND
C9, H13, M3, M6, M13
C7
LVCMOS V
+ 2.5 V ± 5%
CC_2.5 V
D1, E2, L2
B12, D13, J13, N11
A3, A5
CML V -5.2 V ± 5%
EE
SUBVEE
Substrate V -5.2 V ± 5%
EE
ANALOG AVCC
DIGITALVCC
GND
Analog V
+ 3.3 V ± 5%
+ 3.3 V ± 5%
CC_3.3 V
Digital V
CC_3.3 V
C8
A1, A2, A4, A8, A10, A13, A14, B2, B3, B5, B6,
B7, B14, C2, C3, C5, C10, C12, D2, D14, E1,
E13, F1, F2, H1, H2, K1, K2, L1, L14, M1, M4,
M5, M7, M10, N1, N10, P1, P2, P11, P12, P13,
P14
Analog/Digital Ground
THERMAL GND
0 V
GND
E6, E7, E8, E9, E10, F5, F6, F7, F8, F9, F10,
G5, G6, G7, G8, G9, G10, H5, H6, H7, H8, H9,
H10, J5, J6, J7, J8, J9, J10, K5, K6, K7, K8, K9,
K10
Thermal Ground
Note: All digital, analog, and thermal grounds are connected together on the package.
AMCC Confidential and Proprietary
11
AMCC [ APPLIED MICRO CIRCUITS CORPORATION ]
