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PPC440GP-3RC400C 参数 Datasheet PDF下载

PPC440GP-3RC400C图片预览
型号: PPC440GP-3RC400C
PDF下载: 下载PDF文件 查看货源
内容描述: 的Power PC 440GP嵌入式处理器 [Power PC 440GP Embedded Processor]
分类和应用: 微控制器和处理器外围集成电路微处理器PC时钟
文件页数/大小: 83 页 / 1393 K
品牌: AMCC [ APPLIED MICRO CIRCUITS CORPORATION ]
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Revision 1.07 – October 4, 2007  
440GP – Power PC 440GP Embedded Processor  
Data Sheet  
Heat Sink Mounting Information (Ceramic Package Only)  
Proper thermal design is primarily dependent upon multiple system-level effects; that is, the effects of the heat  
sink, the air flow, and the thermal interface material. To reduce the die-junction temperature, heat sinks may be  
attached to the package by several methods: adhesive, spring clips to the printed-circuit board or package, or a  
mounting clip and screw assembly. When attaching heat sinks, it is important to avoid placing excessive  
mechanical stress on bonding of the chip to the substrate and the package to the board.  
Heat Sink Attached With Spring Clip  
Heat sink  
Heat sink  
Heat sink clip  
Heat sink clip  
Thermal grease  
Thermal grease  
CBGA  
CBGA  
package  
package  
Printed  
circuit  
board  
Printed  
circuit  
board  
Spring clip to package  
Spring clip to board  
1
Static compression (spring force)—2.27kg maximum  
Static compression (spring force)—2.27kg maximum  
Note 1: Force is limited by allowable compression on the die.  
Allowable package compression force is 4.4kg.  
Heat Sink Attached With Adhesive  
Heat sink  
Adhesive  
Printed  
circuit  
board  
CBGA  
CBGA  
package  
package  
Adhesive  
Printed  
circuit  
board  
Heat sink  
Weight  
force  
Weight  
force  
Heat sink weight force—60g maximum  
Important: All of the guidelines indicated in the above diagrams must be evaluated and adjusted to account for the  
shock and vibration effects of any particular application.  
AMCC  
57  
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