欢迎访问ic37.com |
会员登录 免费注册
发布采购

PPC440GP-3RC400C 参数 Datasheet PDF下载

PPC440GP-3RC400C图片预览
型号: PPC440GP-3RC400C
PDF下载: 下载PDF文件 查看货源
内容描述: 的Power PC 440GP嵌入式处理器 [Power PC 440GP Embedded Processor]
分类和应用: 微控制器和处理器外围集成电路微处理器PC时钟
文件页数/大小: 83 页 / 1393 K
品牌: AMCC [ APPLIED MICRO CIRCUITS CORPORATION ]
 浏览型号PPC440GP-3RC400C的Datasheet PDF文件第52页浏览型号PPC440GP-3RC400C的Datasheet PDF文件第53页浏览型号PPC440GP-3RC400C的Datasheet PDF文件第54页浏览型号PPC440GP-3RC400C的Datasheet PDF文件第55页浏览型号PPC440GP-3RC400C的Datasheet PDF文件第57页浏览型号PPC440GP-3RC400C的Datasheet PDF文件第58页浏览型号PPC440GP-3RC400C的Datasheet PDF文件第59页浏览型号PPC440GP-3RC400C的Datasheet PDF文件第60页  
Revision 1.07 – October 4, 2007  
440GP – Power PC 440GP Embedded Processor  
Data Sheet  
Package Thermal Specifications  
Thermal resistance values for the CBGA and PBGA packages in a convection environment are as follows:  
Airflow  
ft/min (m/sec)  
Parameter  
Symbol  
Package  
Unit  
Notes  
0 (0)  
<0.1  
1.2  
100 (0.51)  
<0.1  
200 (1.02)  
<0.1  
Ceramic  
Plastic  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
1
Junction-to-case thermal resistance  
θJC  
θCA  
θJB  
1.2  
1.2  
1, 3  
2
Ceramic  
Plastic  
18.9  
17.7  
16.3  
Case-to-ambient thermal resistance (w/o heat  
sink)  
20.8  
2, 3  
Ceramic  
Plastic  
Junction-to-ball (typical)  
8.0  
3
Notes:  
1. Case temperature, TC, is measured at top center of case surface with device soldered to circuit board.  
2. The case-to-ambient thermal resistance is measured in a JEDEC JESD51-6 standard environment; and may not accurately predict  
thermal performance in production equipment environments. The operational case temperature must be maintained.  
3. Modeled on standard JEDEC 2S2P card, 50x50mm  
56  
AMCC  
 复制成功!