Revision 1.27 - August 22, 2007
PPC405EZ – PowerPC 405EZ Embedded Processor
Preliminary Data Sheet
Table 8. Package Thermal Specifications
The PPC405EZ is designed to operate within a case temperature range of -40°C to +105°C. Thermal resistance values for the
EPBGA packages in a convection environment are as follows:
Airflow
ft/min (m/sec)
Parameter
Symbol
Unit
0 (0)
100 (0.51) 200 (1.02) 300 (1.52) 400 (2.02) 600 (3.03)
Junction-to-ambient thermal resistance
without heat sink
θJA
θJA
29.3
24.1
14.3
22.9
12.3
22.4
11.5
22.0
11.1
21.6
10.7
°C/W
°C/W
Junction-to-ambient thermal resistance
with heat sink
22.7
Resistance Value
Junction-to-case thermal resistance
θJC
θJB
11.9
°C/W
°C/W
Junction-to-board thermal resistance
16.4
Notes:
1. Values in the table are achieved with the following JEDEC standard board: 114.5mm x 101.6mm x 1.6mm, 4 layers.
2. For a chip mounted on a card with at least one signal and two power planes, the following relationships exist:
a. Case temperature, TC, is measured at top center of case surface with device soldered to circuit board.
b. TA = TC – PxθCA, where TA is ambient temperature and P is power consumption.
c. TCMax = TJMax – PxθJC, where TJMax is maximum junction temperature and P is power consumption.
3. Values with a heat sink were achieved with a 38.1mm x 38.1mm x 16.5mm unit, attached to the chip using a 0.1mm thickness of
adhesive having a thermal conductivity of 1.3W/mK.
Thermal Management
The following heat sink was used in the above thermal analysis:
Aavid Thermalloy, PN 79985
The heat sink is manufactured by:
Aavid Thermalloy
70 Commercial St.
Concord, NH 03301
USA
Tel: (603)224-9988
URL: www.aavidthermalloy.com
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AMCC Proprietary
AMCC [ APPLIED MICRO CIRCUITS CORPORATION ]
