8
Device and Package Cross Reference
Cyclone Devices
lists the device name, package type, and number of pins for the Cyclone
device family.
1
The package type entries with “Option #” refer to instances where multiple package
options exist for a given package type and pin count. The option number identifies the
specific type used by the corresponding device density.
Table 6.
Cyclone Devices
Device
EP1C3
EP1C4
TQFP, Wire Bond
TQFP, Wire Bond
FBGA, Wire Bond, Option 1
FBGA, Wire Bond
TQFP, Wire Bond
EP1C6
PQFP, Wire Bond
FBGA, Wire Bond, Option 1
PQFP, Wire Bond
EP1C12
FBGA, Wire Bond, Option 1
FBGA, Wire Bond, Option 1
EP1C20
FBGA, Wire Bond, Option 1
FBGA, Wire Bond
Package
Pins
100
144
324
400
144
240
256
240
256
324
324
400
MAX 9000 Devices
lists the device name, package type, and number of pins for the MAX 9000
device family.
Table 7.
MAX 9000 Devices
Device
EPM9320
EPM9320A
EPM9560
BGA, Wire Bond
BGA, Wire Bond
BGA, Wire Bond
Package
Pins
356
356
356
MAX 7000 Devices
lists the device name, package type, and number of pins for the MAX 7000
device family.
1
The package type entries with “Option #” refer to instances where multiple package
options exist for a given package type and pin count. The option number identifies the
specific type used by the corresponding device density.
© December 2011
Altera Corporation
ALTERA [ ALTERA CORPORATION ]
