Device and Package Cross Reference
7
Cyclone II Devices
lists the device name, package type, and number of pins for the Cyclone II
device family.
1
The package type entries with “Option #” refer to instances where multiple package
options exist for a given package type and pin count. The option number identifies the
specific type used by the corresponding device density.
Table 5.
Cyclone II Devices
Device
TQFP, Wire Bond
EP2C5
PQFP, Wire Bond
FBGA, Wire Bond, Option 2, Thin
TQFP, Wire Bond
EP2C8
PQFP, Wire Bond
FBGA, Wire Bond, Option 2, Thin
EP2C8A
EP2C15A
FBGA, Wire Bond, Option 2, Thin
FBGA, Wire Bond, Option 2, Thin
FBGA, Wire Bond, A:2.40
PQFP, Wire Bond
EP2C20
FBGA, Wire Bond, Option 2, Thin
FBGA, Wire Bond, A:2.40
EP2C20A
FBGA, Wire Bond, Option 2, Thin
FBGA, Wire Bond, A:2.40
FBGA, Wire Bond, A:2.40
EP2C35
UBGA, Wire Bond
FBGA, Wire Bond, A:2.40
FBGA, Wire Bond, A:2.40
EP2C50
UBGA, Wire Bond
FBGA, Wire Bond, A:2.40
EP2C70
FBGA, Wire Bond, A:2.40
FBGA, Wire Bond, A:2.40
Package
Pins
144
208
256
144
208
256
256
256
484
240
256
484
256
484
484
484
672
484
484
672
672
896
© December 2011
Altera Corporation
ALTERA [ ALTERA CORPORATION ]
