10
Device and Package Cross Reference
Table 8.
MAX 7000 Devices (Part 2 of 2)
Device
TQFP, Wire Bond
FBGA, Wire Bond, Option 1
EPM7256AE
TQFP, Wire Bond
PQFP, Wire Bond
FBGA, Wire Bond, Option 1
TQFP, Wire Bond
EPM7512AE
PQFP, Wire Bond
BGA, Wire Bond, Option 1
FBGA, Wire Bond, Option 1
EPM7032A
PLCC, Wire Bond
TQFP, Wire Bond
PLCC, Wire Bond
TQFP, Wire Bond
EPM7128A
FBGA, Wire Bond
TQFP, Wire Bond
FBGA, Wire Bond, Option 1
TQFP, Wire Bond
EPM7256A
TQFP, Wire Bond
PQFP, Wire Bond
FBGA, Wire Bond, Option 1
EPM7192E
PGA, Wire Bond
PQFP, Wire Bond
Package
Pins
100
100
144
208
256
144
208
256
256
44
44
84
100
100
144
256
100
144
208
256
160
160
MAX 3000A Devices
lists the device name, package type, and number of pins for the MAX 3000A
device family.
1
The package type entries with “Option #” refer to instances where multiple package
options exist for a given package type and pin count. The option number identifies the
specific type used by the corresponding device density.
Table 9.
MAX 3000A Devices (Part 1 of 2)
Device
EPM3032A
PLCC, Wire Bond
TQFP, Wire Bond
TQFP, Wire Bond
EPM3064A
EPM3128A
PLCC, Wire Bond
TQFP, Wire Bond
TQFP, Wire Bond
Package
Pins
44
44
44
44
100
100
© December 2011
Altera Corporation
ALTERA [ ALTERA CORPORATION ]
