Device and Package Cross Reference
11
Table 9.
MAX 3000A Devices (Part 2 of 2)
Device
EPM3256A
EPM3512A
TQFP, Wire Bond
PQFP, Wire Bond
PQFP, Wire Bond
FBGA, Wire Bond, Option 1
Package
Pins
144
208
208
256
HardCopy II Devices
lists the device name, package type, and number of pins for the HardCopy II
device family.
1
The package type entries with “Option #” refer to instances where multiple package
options exist for a given package type and pin count. The option number identifies the
specific type used by the corresponding device density.
Table 10.
HardCopy II Devices
Device
HC210
HC220
HC230
HC240
Package
FBGA, Wire Bond, A:2.40
Single-Piece Lid: FBGA, Flip Chip, Option 4
Single-Piece Lid: FBGA, Flip Chip, Option 3
Single-Piece Lid: FBGA, Flip Chip, Option 2
Single-Piece Lid: FBGA, Flip Chip, Option 2
Single-Piece Lid: FBGA, Flip Chip, Option 2
Pins
484
672
780
1020
1020
1508
HardCopy Devices
lists the device name, package type, and number of pins for the HardCopy
device family.
1
The package type entries with “Option #” refer to instances where multiple package
options exist for a given package type and pin count. The option number identifies the
specific type used by the corresponding device density.
Table 11.
HardCopy Devices
Device
HC1S25
HC1S30
HC1S40
HC1S60
HC1S80
BGA, Wire Bond
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Package
FBGA, Wire Bond, A:2.40
Pins
672
672
780
780
1020
1020
© December 2011
Altera Corporation
ALTERA [ ALTERA CORPORATION ]
