Device and Package Cross Reference
5
Stratix Devices
lists the device name, package type, and number of pins for the Stratix device
family.
1
The package type entries with “Option #” refer to instances where multiple package
options exist for a given package type and pin count. The option number identifies the
specific type used by the corresponding device density.
Table 4.
Stratix Devices (Part 1 of 2)
Device
EP1SGX10
Package
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 4
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 4
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 2
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 2
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 4
EP1S10
BGA, Wire Bond
FBGA, Wire Bond, Option 2
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 3
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 4
EP1S20
BGA, Wire Bond
FBGA, Wire Bond, Option 2
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 3
BGA, Wire Bond
FBGA, Wire Bond, Option 2
EP1S25
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 3
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 2
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 3
EP1S30
Dual-Piece Lid: BGA, Flip Chip, Option 1
Single-Piece Lid: BGA, Flip Chip, Option 2
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 2
Pins
672
672
1020
1020
484
672
672
780
484
672
672
780
672
672
780
1020
780
956
1020
EP1SGX25
EP1SGX40
© December 2011
Altera Corporation
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