Device and Package Cross Reference
15
APEX 20KC Devices
lists the device name, package type, and number of pins for the APEX 20KC
device family.
1
The package type entries with “Option #” refer to instances where multiple package
options exist for a given package type and pin count. The option number identifies the
specific type used by the corresponding device density.
Table 15.
APEX 20KC Devices
Device
PQFP, Wire Bond
EP20K200C
PQFP, Wire Bond
BGA, Wire Bond
FBGA, Wire Bond, Option 2
EP20K400C
BGA, Wire Bond, Option 3
FBGA, Flip Chip, Option 1
BGA, Wire Bond, Option 3
EP20K600C
FBGA, Flip Chip, Option 1
FBGA, Flip Chip, Option 1
BGA, Flip Chip
EP20K1000C
FBGA, Flip Chip, Option 1
FBGA, Flip Chip, Option 1
Package
Pins
208
240
356
484
652
672
652
672
1020
652
672
1020
APEX 20K Devices
lists the device name, package type, and number of pins for the APEX 20K
device family.
1
The package type entries with “Option #” refer to instances where multiple package
options exist for a given package type and pin count. The option number identifies the
specific type used by the corresponding device density.
Table 16.
APEX 20K Devices (Part 1 of 2)
Device
TQFP, Wire Bond
PQFP, Wire Bond
EP20K100
PQFP, Wire Bond
FBGA, Wire Bond, Option 1
BGA, Wire Bond
EP20K160
PQFP, Wire Bond
TQFP, Wire Bond
Package
Pins
144
208
240
324
356
240
144
© December 2011
Altera Corporation
ALTERA [ ALTERA CORPORATION ]
