7–18
Chapter 7: Package Information
Document Revision History
Document Revision History
Table 7–3 shows the revision history for this chapter.
Table 7–3. Document Revision History
Date and Revision
Changes Made
Summary of Changes
October 2008,
version 2.1
■ Updated New Document Format.
—
December 2007,
version 2.0
■ Updated Table 7–1 and Table 7–2.
■ Updated document with
MAX IIZ information.
■ Added “68-Pin Micro FineLine Ball-Grid Array (MBGA) –
Wire Bond” and “144-Pin Micro FineLine Ball-Grid Array ■ Added information about
(MBGA) – Wire Bond” sections.
68-Pin Micro FineLine
Ball-Grid Array and 144-
Pin Micro FineLine
Ball-Grid Array.
■ Replaced Figure 7–9 with correct diagram.
December 2006,
version 1.4
■ Added document revision history.
■ Updated packaging information.
—
—
—
—
July 2006,
version 1.3
August 2005,
version 1.2
■ Updated the 100-pin plastic thin quad flat pack (TQFP)
information.
December 2004,
version 1.1
■ Updated Board Decoupling Guidelines section (changed
the 0.2 value to 0.1.)
MAX II Device Handbook
© October 2008 Altera Corporation
ALTERA [ ALTERA CORPORATION ]
