7–16
Chapter 7: Package Information
Package Outlines
Figure 7–8. 256-Pin FineLine BGA Package Outline
TOP VIEW
BOTTOM VIEW
D
Pin A1
Corner
Pin A1 ID
b
e
324-Pin FineLine Ball-Grid Array (FBGA)
■
■
■
All dimensions and tolerances conform to ANSI Y14.5M – 1994
Controlling dimension is in millimeters
Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on
package surface
Package Information (Part 1 of 2)
Package Outline Dimension Table (Part 1 of 2)
Description
Specification
Millimeters
Symbol
Ordering Code Reference
F
Min.
Nom.
Max.
Package Acronym
Substrate Material
FBGA
BT
A
A1
A2
A3
D
—
0.30
—
—
—
2.20
—
—
1.80
Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
Solder Ball Composition
0.70 REF
19.00 BSC
19.00 BSC
JEDEC Outline Reference MS-034 Variation: AAG-1
Maximum Lead
0.008 inches (0.20 mm)
Coplanarity
E
Weight
1.6 g
b
0.50
0.60
0.70
MAX II Device Handbook
© October 2008 Altera Corporation