Chapter 7: Package Information
7–15
Package Outlines
256-Pin FineLine Ball-Grid Array (FBGA)
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■
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All dimensions and tolerances conform to ANSI Y14.5M – 1994
Controlling dimension is in millimeters
Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on
package surface
Package Information
Package Outline Dimension Table
Description
Specification
Millimeters
Nom.
Ordering Code Reference
F
Min.
Max.
Package Acronym
Substrate Material
FBGA
BT
A
A1
A2
A3
D
—
0.30
—
—
—
2.20
—
—
1.80
Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
Solder Ball Composition
0.70 REF
17.00 BSC
17.00 BSC
JEDEC Outline Reference MS-034 Variation: AAF-1
Maximum Lead
0.008 inches (0.20 mm)
Coplanarity
E
Weight
1.5 g
b
e
0.50
0.60
0.70
Printed on moisture barrier
bag
1.00 BSC
Moisture Sensitivity Level
© October 2008 Altera Corporation
MAX II Device Handbook
ALTERA [ ALTERA CORPORATION ]
