7–12
Chapter 7: Package Information
Package Outlines
144-Pin Micro FineLine Ball-Grid Array (MBGA) – Wire Bond
■
■
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All dimensions and tolerances conform to ASME Y14.5M – 1994.
Controlling dimension is in millimeters.
Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on
package surface
Package Information
Package Outline Dimension Table
Description
Specification
Millimeters
Nom.
Symbol
Ordering Code Reference
M
Min.
Max.
Package Acronym
MBGA
BT
A
—
0.15
—
—
—
1.20
—
Substrate Material
A1
A2
A3
D
Solder Ball Composition
Pb-free: Sn:3Ag:0.5Cu (Typ.)
—
1.00
JEDEC Outline Reference MO-195 Variation: AD
0.60 REF
7.00 BSC
Maximum Lead
0.003 inches (0.08 mm)
Coplanarity
Weight
0.1 g
E
b
7.00 BSC
0.30
Printed on moisture barrier
bag
0.25
0.35
Moisture Sensitivity Level
e
0.50 BSC
MAX II Device Handbook
© October 2008 Altera Corporation
ALTERA [ ALTERA CORPORATION ]
