Chapter 7: Package Information
7–13
Package Outlines
Figure 7–6. 144-Pin Micro FineLine BGA Package Outline
BOTTOM VIEW
TOP VIEW
D
Pin A1
Corner
13
12
10
9
8
7
6
5
4
3
2
1
11
A
B
C
D
E
F
Pin A1 ID
G
H
J
K
L
M
N
e
b
256-Pin Micro FineLine Ball-Grid Array (MBGA)
■
■
■
All dimensions and tolerances conform to ASME Y14.5 – 1994
Controlling dimension is in millimeters
Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on
package surface
Package Information (Part 1 of 2)
Package Outline Dimension Table (Part 1 of 2)
Description
Specification
Millimeters
Symbol
Ordering Code Reference
M
Min.
Nom.
Max.
Package Acronym
MBGA
BT
A
—
0.15
—
—
—
1.20
—
Substrate Material
A1
A2
A3
D
Solder Ball Composition
Pb-free: Sn:3Ag:0.5Cu (Typ.)
—
1.00
JEDEC Outline Reference MO-192 Variation: BH
0.60 REF
11.00 BSC
Maximum Lead
0.003 inches (0.08 mm)
Coplanarity
Weight
0.3 g
E
11.00 BSC
© October 2008 Altera Corporation
MAX II Device Handbook
ALTERA [ ALTERA CORPORATION ]
