Chapter 7: Package Information
7–9
Package Outlines
Package Information
Package Outline Dimension Table
A2
A3
D
1.05 REF
—
Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
Solder Ball Composition
—
0.80
JEDEC Outline Reference MO-192 Variation: DAC-1
11.00 BSC
11.00 BSC
Maximum Lead
0.008 inches (0.20 mm)
Coplanarity
E
Weight
0.6 g
b
e
0.45
0.50
0.55
Printed on moisture barrier
bag
1.00 BSC
Moisture Sensitivity Level
Figure 7–4. 100-Pin FineLine BGA Package Outline
BOTTOM VIEW
TOP VIEW
Pin A1
Corner
D
10
9
8
7
6
5
4
3
2
1
A
B
C
D
E
F
Pin A1 ID
G
H
J
K
b
e
© October 2008 Altera Corporation
MAX II Device Handbook
ALTERA [ ALTERA CORPORATION ]
