Package Information Datasheet for Mature Altera Devices
Device and Package Cross Reference
21
Table 21. FLEX 10KE Devices (Part 3 of 3)
Device
Package
Pins
144
208
240
256
100
100
144
208
256
144
208
240
256
256
84
TQFP, Wire Bond
PQFP, Wire Bond
PQFP, Wire Bond
BGA, Wire Bond, Option 2
TQFP, Wire Bond
FBGA, Wire Bond
TQFP, Wire Bond
PQFP, Wire Bond
EPF6016
EPF6016A
EPF6024A
FBGA, Wire Bond, Option 1
TQFP, Wire Bond
PQFP, Wire Bond
PQFP, Wire Bond
BGA, Wire Bond, Option 2
FBGA, Wire Bond, Option 1
PLCC, Wire Bond
EPF8282A
EPF8452A
TQFP, Wire Bond
100
100
160
TQFP, Wire Bond
PQFP, Wire Bond
Excalibur Devices
Table 22 lists the device name, package type, and number of pins for the Excalibur
device family.
1
The package type entries with “Option #” refer to instances where multiple package
optionsexistforagivenpackagetypeandpincount.Theoptionnumberidentifiesthe
specific type used by the corresponding device density.
Table 22. Excalibur Devices
Device
Package
FBGA, Wire Bond, Option 2
Pins
484
EPXA1
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Dual-Piece Lid: FBGA, Flip Chip, Option 1
672
672
EPXA4
1020
1020
EPXA10
© December 2011 Altera Corporation
Package Information Datasheet for Mature Altera Devices
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