24
Package Information Datasheet for Mature Altera Devices
Thermal Resistance
This change affects the APEX 20KE, APEX 20KC, APEX II, Mercury, and Excalibur
device families. Therefore, two thermal resistance specifications are provided for
devices affected by this change. The older packages are identified as using the
aluminum silicon carbide (AlSiC) lid, while the newer packages are identified as
using the copper (Cu) lid.
ThermallyenhancedBGAandthermallyenhancedFlipChipFBGApackagesoffered
in the newer Altera families, including Stratix and Stratix GX, were introduced using
an industry-standard Cu lid. Therefore, these device specifications include only a
single thermal resistance specification.
1
Contact Altera if you need typical +/– values of A dimensions for thermal analysis.
The max numbers are provided for physical layout.
Arria Series Devices Thermal Resistance
Table 26 provides thermal resistance values for Arria series devices.
Arria GX Devices
Table 26 lists the thermal resistance of Arria GX devices.
Table 26. Thermal Resistance of Arria GX Devices
JA
(° C/W)
Still Air
JA
Pin
Count
JA (° C/W)
JA (° C/W)
JC
(° C/W)
JB
(° C/W)
Device
Package
(° C/W)
100 ft./min. 200 ft./min.
400 ft./min.
FBGA
FBGA
FBGA
FBGA
FBGA
FBGA
FBGA
FBGA
FBGA
FBGA
FBGA
484
780
12.8
11.1
12.8
11.1
12.7
10.9
9.9
10.3
8.6
8.7
7.2
8.7
7.2
8.6
6.9
6.1
8.6
6.9
6.1
5.9
7.5
6.0
7.5
6.0
7.3
5.8
5.0
7.3
5.8
5.0
4.9
0.3
0.2
0.3
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.1
3.1
3.1
3.1
3.1
2.9
2.9
2.5
2.9
2.8
2.5
2.3
EP1AGX20
EP1AGX35
484
10.3
8.6
780
484
10.2
8.4
EP1AGX50
780
1152
484
7.5
12.7
10.9
9.9
10.2
8.4
EP1AGX60
EP1AGX90
780
1152
1152
7.5
9.6
7.3
Package Information Datasheet for Mature Altera Devices
© December 2011 Altera Corporation
ALTERA [ ALTERA CORPORATION ]
