22
Package Information Datasheet for Mature Altera Devices
Device and Package Cross Reference
Configuration Devices
Table 23 lists the device name, package type, and number of pins for the
Configuration device family.
1
The package type entries with “Option #” refer to instances where multiple package
optionsexistforagivenpackagetypeandpincount.Theoptionnumberidentifiesthe
specific type used by the corresponding device density.
Table 23. Configuration Devices
Device
Package
Pins
8
PDIP, Wire Bond
PLCC, Wire Bond
PLCC, Wire Bond
TQFP, Wire Bond
PDIP, Wire Bond
PLCC, Wire Bond
PDIP, Wire Bond
PLCC, Wire Bond
PDIP, Wire Bond
PLCC, Wire Bond
TQFP, Wire Bond
EPC1
20
20
32
8
EPC2
EPC1064
EPC1213
20
8
20
8
EPC1441
20
32
Enhanced Configuration Devices
Table 24 lists the device name, package type, and number of pins for the Enhanced
configuration device family.
1
The package type entries with “Option #” refer to instances where multiple package
optionsexistforagivenpackagetypeandpincount.Theoptionnumberidentifiesthe
specific type used by the corresponding device density.
Table 24. Enhanced Configuration Devices
Device
EPC4
Package
Pins
100
100
88
PQFP, Wire Bond
PQFP, Wire Bond
UBGA, Wire Bond
PQFP, Wire Bond
EPC8
EPC16
100
Package Information Datasheet for Mature Altera Devices
© December 2011 Altera Corporation
ALTERA [ ALTERA CORPORATION ]
