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EP1AGX60 参数 Datasheet PDF下载

EP1AGX60图片预览
型号: EP1AGX60
PDF下载: 下载PDF文件 查看货源
内容描述: 对于成熟的Altera器件封装信息数据表 [Package Information Datasheet for Mature Altera Devices]
分类和应用:
文件页数/大小: 182 页 / 2063 K
品牌: ALTERA [ ALTERA CORPORATION ]
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18  
Package Information Datasheet for Mature Altera Devices  
Device and Package Cross Reference  
FLEX 10KS Devices  
Table 20 lists the device name, package type, and number of pins for the FLEX 10KS  
device family.  
1
The package type entries with “Option #” refer to instances where multiple package  
optionsexistforagivenpackagetypeandpincount.Theoptionnumberidentifiesthe  
specific type used by the corresponding device density.  
Table 20. FLEX 10KS Devices  
Device  
Package  
Pins  
144  
208  
240  
256  
356  
484  
240  
356  
484  
600  
672  
TQFP, Wire Bond  
PQFP, Wire Bond  
PQFP, Wire Bond  
EPF10K50S  
FBGA, Wire Bond, Option 1  
BGA, Wire Bond  
FBGA, Wire Bond, Option 2  
RQFP, Wire Bond  
BGA, Wire Bond  
EPF10K200S  
FBGA, Wire Bond, Option 2  
BGA, Wire Bond  
FBGA, Wire Bond, Option 2  
FLEX 10KE Devices  
Table 21 lists the device name, package type, and number of pins for the FLEX 10KE  
device family.  
1
The package type entries with “Option #” refer to instances where multiple package  
optionsexistforagivenpackagetypeandpincount.Theoptionnumberidentifiesthe  
specific type used by the corresponding device density.  
Table 21. FLEX 10KE Devices (Part 1 of 3)  
Device  
Package  
Pins  
144  
208  
256  
484  
144  
208  
240  
256  
356  
484  
TQFP, Wire Bond  
PQFP, Wire Bond  
EPF10K30E  
FBGA, Wire Bond, Option 1  
FBGA, Wire Bond, Option 2  
TQFP, Wire Bond  
PQFP, Wire Bond  
PQFP, Wire Bond  
EPF10K50E  
FBGA, Wire Bond, Option 1  
BGA, Wire Bond  
FBGA, Wire Bond, Option 2  
Package Information Datasheet for Mature Altera Devices  
© December 2011 Altera Corporation  
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