Package Information Datasheet for Mature Altera Devices
Thermal Resistance
23
Thermal Resistance
Altera follows JEDEC JESD51 series standards to provide thermal resistances. The
purpose of the JESD51 standards is to compare the thermal performance of various
packagesunderstandardizedtestconditions.Whilestandardizedthermalresistances
canhelpcomparetherelativethermalperformanceofdifferentpackages,theycannot
apply directly to the many specific applications because JESD51 test conditions may
not match a specific application. Several factors affect the thermal performance of a
device in a user’s application. These include power dissipation in the component;
airflow velocity, direction and turbulence level; power in adjacent components;
two-sided vs. one-sided active component mounting; printed circuit board (PCB)
orientation & construction; and adjacent boards and their power dissipation. It may
be necessary to test or model specific applications. This testing and modeling of a
component user’s specific applications is the user’s responsibility.
Table 26throughTable 43provideJA(junction-to-ambientthermalresistance)andJC
(junction-to-case thermal resistance) values for the Altera device families. Altera
reserves the right to make changes to thermal resistances without notice in the future.
Table 25 lists the mature Altera devices and the associated table locations.
Table 25. Thermal Resistance
Altera Device
Arria series FPGAs
Table Location
■ Arria GX Devices: Table 26 on page 24
■ Stratix II Devices: Table 27 on page 25
■ Stratix Devices: Table 28 on page 26
■ Cyclone II Devices: Table 29 on page 27
■ Cyclone Devices: Table 30 on page 28
■ MAX 9000 Devices: Table 31 on page 29
■ MAX 7000 Devices: Table 32 on page 30
■ MAX 3000A Devices: Table 33 on page 33
■ HardCopy II Devices: Table 34 on page 34
■ HardCopy Devices: Table 35 on page 34
■ APEX II Devices: Table 36 on page 35
■ APEX 20K: Table 37 on page 36
Stratix series FPGAs
Cyclone series FPGAs
MAX series CPLDs
HardCopy series ASICs
APEX series FPGAs
ACEX 1K FPGAs
Mercury FPGAs
ACEX 1K Devices: Table 38 on page 38
Mercury Devices: Table 39 on page 39
■ FLEX 10K Devices: Table 40 on page 39
■ FLEX 8000 Devices: Table 41 on page 41
■ FLEX 6000 Devices: Table 42 on page 42
Excalibur Devices: Table 43 on page 43
FLEX series FPGAs
Excalibur FPGAs
Altera is transitioning to an industry-standard copper lid for its thermally enhanced
BGA and thermally enhanced Flip Chip FBGA package offerings.
f
For more information, refer to Process Change Notice PCN0214.
© December 2011 Altera Corporation
Package Information Datasheet for Mature Altera Devices
ALTERA [ ALTERA CORPORATION ]
