Package Information Datasheet for Mature Altera Devices
Device and Package Cross Reference
17
Mercury Devices
Table 18 lists the device name, package type, and number of pins for the Mercury
device family.
1
The package type entries with “Option #” refer to instances where multiple package
optionsexistforagivenpackagetypeandpincount.Theoptionnumberidentifiesthe
specific type used by the corresponding device density.
Table 18. Mercury Devices
Device
Package
Pins
484
780
EP1M120
EP1M350
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Dual-Piece Lid: FBGA, Flip Chip, Option 1
FLEX 10KA Devices
Table 19 lists the device name, package type, and number of pins for the FLEX 10KA
device family.
1
The package type entries with “Option #” refer to instances where multiple package
optionsexistforagivenpackagetypeandpincount.Theoptionnumberidentifiesthe
specific type used by the corresponding device density.
Table 19. FLEX 10KA Devices
Device
Package
Pins
100
144
208
256
144
208
240
256
356
484
240
356
484
600
599
600
TQFP, Wire Bond
TQFP, Wire Bond
PQFP, Wire Bond
EPF10K10A
FBGA, Wire Bond, Option 1
TQFP, Wire Bond
PQFP, Wire Bond
PQFP, Wire Bond
EPF10K30A
FBGA, Wire Bond, Option 1
BGA, Wire Bond
FBGA, Wire Bond, Option 2
RQFP, Wire Bond
BGA, Wire Bond
EPF10K100A
EPF10K250A
FBGA, Wire Bond, Option 2
BGA, Wire Bond
PGA, Wire Bond
BGA, Wire Bond
© December 2011 Altera Corporation
Package Information Datasheet for Mature Altera Devices
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