AD±±70
OUTLINE DIMENSIONS
6.50
6.20
5.90
16
9
8
5.60
5.30
5.00
8.20
7.80
7.40
1
1.85
1.75
1.65
2.00 MAX
0.25
0.09
8°
4°
0°
0.95
0.75
0.55
0.38
0.22
0.05 MIN
SEATING
PLANE
0.65
BSC
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-150AC
Figure 46. 16-Lead Shrink Small Outline Package [SSOP]
(RS-16)
Dimensions shown in millimeters
ORDERING GUIDE
Model
AD55±0ARS
AD55±0ARS-REEL
AD55±0ARS-REEL±
AD55±0BRS
AD55±0BRS-REEL
AD55±0BRS-REEL±
AD55±0WRS
AD55±0WRS-REEL
AD55±0WRS-REEL±
AD55±0YRS
AD55±0YRS-REEL
AD55±0YRS-REEL±
Eval-AD55±0EB
Temperature Range
Package Description
16-Lead SSOP
16-Lead SSOP
16-Lead SSOP
16-Lead SSOP
16-Lead SSOP
16-Lead SSOP
16-Lead SSOP
16-Lead SSOP
16-Lead SSOP
16-Lead SSOP
16-Lead SSOP
16-Lead SSOP
Evaluation Board
Package Option
RS-16
RS-16
RS-16
RS-16
RS-16
RS-16
RS-16
RS-16
RS-16
RS-16
RS-16
RS-16
−40 °C to +ꢁ5 °C
−40 °C to +ꢁ5 °C
−40 °C to +ꢁ5 °C
−40 °C to +ꢁ5 °C
−40 °C to +ꢁ5 °C
−40 °C to +ꢁ5 °C
−40 °C to +125 °C
−40 °C to +125 °C
−40 °C to +125 °C
−40 °C to +125 °C
−40 °C to +125 °C
−40 °C to +125 °C
©
2003 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
C03760–0–11/03(0)
Rev. 0 | Page 24 of 24
ADI [ ADI ]
