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EVAL-AD5570EB 参数 Datasheet PDF下载

EVAL-AD5570EB图片预览
型号: EVAL-AD5570EB
PDF下载: 下载PDF文件 查看货源
内容描述: 真正的精度, 16位12 V / 15 V ,串行输入电压输出DAC [True Accuracy, 16-Bit 12 V/15 V, Serial Input Voltage Output DAC]
分类和应用:
文件页数/大小: 24 页 / 1039 K
品牌: ADI [ ADI ]
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AD±±70  
Table 8. Partial List of Precision References Recommended  
for Use with the AD5570  
OPTO-COUPLER INTERFACE  
In many process control applications, it is necessary to provide  
an isolation barrier between the controller and the unit being  
controlled. Opto-isolators can provide voltage isolation in  
excess of 3 kV. The serial loading structure of the AD5570  
makes it ideal for opto-isolated interfaces, because the number  
of interface lines is kept to a minimum. Figure ꢁ0 shows a  
ꢁ-channel isolated interface to the AD5570. To reduce the  
number of opto-isolators, if the simultaneous updating of the  
DAC is not required, the LDAC pin may be tied permanently  
low. The DAC can then be updated on the rising edge of SYNC.  
Initial  
Accuracy  
(mV max) (ppm typ)  
Long-Term  
Drift  
Temp Drift  
(ppm/  
°C max)  
0.1 Hz to  
10 Hz Noise  
(µV p-p typ)  
Part No.  
ADR435  
ADR425  
ADR021  
ADR3ꢀ5  
AD5ꢁ6  
30  
50  
50  
50  
15  
3
3.4  
3.4  
15  
5
± 6  
± 6  
±5  
±6  
±2.5  
3
3
25  
10  
4
1Available in SC±0 package.  
LAYOUT GUIDELINES  
V
CC  
In any circuit where accuracy is important, careful considera-  
tion of the power supply and ground return layout helps to  
ensure the rated performance. The printed circuit board on  
which the AD5570 is mounted should be designed so that the  
analog and digital sections are separated and confined to  
certain areas of the board. If the AD5570 is in a system where  
multiple devices require an AGND-to-DGND connection, the  
connection should be made at one point only. The star ground  
point should be established as close as possible to the device.  
µCONTROLLER  
CONTROL OUT  
TO LDAC  
TO SYNC  
TO SCLK  
TO SDIN  
SYNC OUT  
SERIAL CLOCK OUT  
The AD5570 should have ample supply bypassing of 10 µF in  
parallel with 0.1 µF on each supply located as close to the pack-  
age as possible, ideally right up against the device. The 10 µF  
capacitors are the tantalum bead type. The 0.1 µF capacitor  
should have low effective series resistance (ESR) and effective  
series inductance (ESI) such as the common ceramic types,  
which provide a low impedance path to ground at high frequen-  
cies to handle transient currents due to internal logic switching.  
SERIAL DATA OUT  
OPTO-COUPLER  
Figure 40. Opto-Isolated Interface  
The power supply lines of the AD5570 should use as large a  
trace as possible to provide low impedance paths and reduce the  
effects of glitches on the power supply line. Fast switching  
signals such as clocks should be shielded with digital ground to  
avoid radiating noise to other parts of the board, and should  
never be run near the reference inputs. A ground line routed  
between the SDIN and SCLK lines helps reduce crosstalk  
between them (not required on a multilayer board, which has a  
separate ground plane, but separating the lines helps). It is  
essential to minimize noise on the REFIN line, because it  
couples through to the DAC output.  
MICROPROCESSOR INTERFACING  
Microprocessor interfacing to the AD5570 is via a serial bus  
that uses standard protocol compatible with microcontrollers  
and DSP processors. The communications channel is a 3-wire  
(minimum) interface consisting of a clock signal, a data signal,  
and a synchronization signal. The AD5570 requires a 16-bit  
data word with data valid on the falling edge of SCLK.  
For all the interfaces, the DAC output update may be done  
automatically when all the data is clocked in, or it may be done  
under the control of  
may be read using the readback function.  
. The contents of the DAC register  
LDAC  
Avoid crossover of digital and analog signals. Traces on opposite  
sides of the board should run at right angles to each other. This  
reduces the effects of feed through the board. A microstrip  
technique is by far the best, but not always possible with a  
double-sided board. In this technique, the component side of  
the board is dedicated to ground plane, while signal traces are  
placed on the solder side.  
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