AD9865
OUTLINE DIMENSIONS
0.30
0.25
0.18
9.00
BSC SQ
0.60 MAX
PIN 1
INDICATOR
0.60 MAX
49
48
64
1
PIN 1
INDICATOR
7.25
7.10 SQ*
6.95
8.75
BSC SQ
EXPOSED PAD
(BOTTOM VIEW)
TOP
VIEW
0.45
0.40
0.35
33
32
16
17
0.25 MIN
7.50
REF
0.80 MAX
0.65 TYP
1.00
0.85
0.80
12° MAX
0.05 MAX
0.02 NOM
0.50 BSC
0.20 REF
SEATING
PLANE
*
COMPLIANT TO JEDEC STANDARDS MO-220-VMMD
EXCEPT FOR EXPOSED PAD DIMENSION
Figure 85. 64-Lead Lead Frame Chip Scale Package (LFCSP)
[CP-64-3]
Dimensions shown in millimeters
ORDERING GUIDE
Model
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
Package Description
64-Lead LFCSP
64-Lead LFCSP
64-Lead LFCSP
64-Lead LFCSP
DIE
Package Option
AD9865BCP
CP-64-3
CP-64-3
CP-64-3
CP-64-3
AD9865BCPRL
AD9865BCPZ1
AD9865BCPZRL1
AD9865CHIPS
AD9865-EB
Evaluation Board
1 Z = Pb-free part.
Rev. A | Page 47 of 48
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