AD9268
ABSOLUTE MAXIMUM RATINGS
THERMAL CHARACTERISTICS
Table 6.
The exposed paddle must be soldered to the ground plane for
the LFCSP package. Soldering the exposed paddle to the PCB
increases the reliability of the solder joints and maximizes the
thermal capability of the package.
Parameter
ELECTRICAL1
Rating
AVDD to AGND
DRVDD to AGND
VIN+A/VIN+B, VIN−A/VIN−B to AGND
CLK+, CLK− to AGND
SYNC to AGND
VREF to AGND
SENSE to AGND
VCM to AGND
RBIAS to AGND
CSB to AGND
SCLK/DFS to AGND
SDIO/DCS to AGND
OEB
−±.3 V to +2.± V
−±.3 V to +2.± V
−±.3 V to AVDD + ±.2 V
−±.3 V to AVDD + ±.2 V
−±.3 V to AVDD + ±.2 V
−±.3V to AVDD + ±.2 V
−±.3V to AVDD + ±.2 V
−±.3V to AVDD + ±.2 V
−±.3V to AVDD + ±.2 V
−±.3 V to DRVDD + ±.2 V
−±.3V to DRVDD + ±.2V
−±.3 V to DRVDD + ±.2 V
−±.3 V to DRVDD + ±.2 V
−±.3 V to DRVDD + ±.2 V
−±.3 V to DRVDD + ±.2 V
Typical θJA is specified for a 4-layer PCB with a solid ground
plane. As shown in Table 7, airflow improves heat dissipation,
which reduces θJA. In addition, metal in direct contact with the
package leads from metal traces, through holes, ground, and
power planes, reduces θJA.
Table 7. Thermal Resistance
Airflow
Velocity
(m/sec)
1, 2
1, 3
1, 4
Package Type
θJA
θJC
1.±
θJB
Unit
°C/W
°C/W
°C/W
64-Lead LFCSP
(CP-64-6)
±
18.ꢀ
16.1
14.ꢀ
1.±
2.ꢀ
9.2
PDWN
D±A/D±B through D1ꢀA/D1ꢀB to
AGND
DCOA/DCOB to AGND
ENVIRONMENTAL
1 Per JEDEC ꢀ1-ꢁ, plus JEDEC 2ꢀ-ꢀ 2S2P test board.
2 Per JEDEC JESDꢀ1-2 (still air) or JEDEC JESDꢀ1-6 (moving air).
3 Per MIL-Std 883, Method 1±12.1.
−±.3 V to DRVDD + ±.2 V
4 Per JEDEC JESDꢀ1-8 (still air).
Operating Temperature Range
(Ambient)
Maximum Junction Temperature
Under Bias
−4±°C to +8ꢀ°C
1ꢀ±°C
ESD CAUTION
Storage Temperature Range
(Ambient)
−6ꢀ°C to +1ꢀ±°C
1 The inputs and outputs are rated to the supply voltage (AVDD or ARVDD) +
±.2 V but should not exceed 2.1 V.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Rev. A | Page 12 of 44
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