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5962-9750701HXC 参数 Datasheet PDF下载

5962-9750701HXC图片预览
型号: 5962-9750701HXC
PDF下载: 下载PDF文件 查看货源
内容描述: 四SHARC DSP多处理器家族 [Quad-SHARC DSP Multiprocessor Family]
分类和应用: 外围集成电路时钟
文件页数/大小: 44 页 / 746 K
品牌: ADI [ ADI ]
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AD14060/AD14060L  
O UTP UT D RIVE CURRENTS  
T he PEXT equation is calculated for each class of pins that can  
drive:  
Figure 26 shows typical I-V characteristics for the output drivers  
of the ADSP-2106x. T he curves represent the current drive  
capability of the output drivers as a function of output voltage.  
P in  
# of  
%
2
Type  
P ins  
Switching 
؋
 C  
؋
 f  
؋
 VDD = P EXT  
120  
100  
Address  
MS0  
WR  
Data  
ADRCLK  
15  
1
1
32  
1
50  
0
50  
× 55 pF  
× 55 pF  
× 55 pF  
× 25 pF  
× 15 pF  
× 20 MHz × 25 V = 0.206 W  
× 20 MHz × 25 V = 0.00 W  
× 40 MHz × 25 V = 0.055 W  
× 20 MHz × 25 V = 0.200 W  
HIGH LEVEL DRIVE  
80  
(P DEVICE)  
60  
40 MHz  
× 25 V = 0.015 W  
40  
20  
PEXT (5 V) = 0.476 W  
PEXT (3.3 V) = 0.207 W  
0
–20  
–40  
–60  
–80  
A typical power consumption can now be calculated for these  
conditions by adding a typical internal power dissipation:  
LOW LEVEL DRIVE  
P
TOTAL = PEXT + (IDDIN2 × 5.0 V )  
–100  
(N DEVICE)  
–120  
–140  
–160  
Note that the conditions causing a worst-case PEXT are different  
from those causing a worst-case PINT . Maximum PINT cannot  
occur while 100% of the output pins are switching from all ones  
to all zeros. Also note that it is not common for an application to  
have 100% or even 50% of the outputs switching simultaneously.  
0
1
2
3
4
5
SOURCE VOLTAGE – V  
Figure 26. ADSP-2106x Typical Drive Currents (VDD = 5 V)  
TEST CO ND ITIO NS  
O utput D isable Tim e  
P O WER D ISSIP ATIO N  
T otal power dissipation has two components, one due to inter-  
nal circuitry and one due to the switching of external output  
drivers. Internal power dissipation is dependent on the instruc-  
tion execution sequence and the data operands involved. Inter-  
nal power dissipation is calculated in the following way:  
Output pins are considered to be disabled when they stop driv-  
ing, go into a high impedance state, and start to decay from  
their output high or low voltage. T he time for the voltage on the  
bus to decay by V is dependent on the capacitive load, CL, and  
the load current, IL. T his decay time can be approximated by  
the following equation:  
PINT = IDDIN × VDD  
T he external component of total power dissipation is caused by  
the switching of output pins. Its magnitude depends on:  
CL V  
tDECAY  
=
IL  
– the number of output pins that switch during each cycle (O)  
– the maximum frequency at which they can switch (f)  
– their load capacitance (C)  
The output disable time, tDIS, is the difference between tMEASURED  
and tDECAY as shown in Figure 27. T he time tMEASURED is the  
interval from when the reference signal switches to when the  
output voltage decays V from the measured output high or  
output low voltage. tDECAY is calculated with test loads CL and  
IL, and with V equal to 0.5 V.  
– their voltage swing (VDD  
)
and is calculated by:  
2
PEXT = O × C × VDD × f  
T he load capacitance should include the processor’s package  
capacitance (CIN). T he switching frequency includes driving the  
load high and then back low. Address and data pins can drive  
high and low at a maximum rate of 1/(2tCK). T he write strobe  
can switch every cycle at a frequency of 1/tCK. Select pins switch  
at 1/(2tCK), but selects can switch on each cycle.  
O utput Enable Tim e  
Output pins are considered to be enabled when they have made  
a transition from a high impedance state to when they start  
driving. T he output enable time, tENA, is the interval from when  
a reference signal reaches a high or low voltage level to when the  
output has reached a specified high or low trip point, as shown  
in the Output Enable/Disable diagram (Figure 27). If multiple  
pins (such as the data bus) are enabled, the measurement value  
is that of the first pin to start driving.  
Example:  
Estimate PEXT with the following assumptions:  
–A system with one bank of external data memory RAM (32-bit)  
Four 128K × 8 RAM chips are used, each with a load of 10 pF  
–External data memory writes occur every other cycle, a rate  
of 1/(4tCK), with 50% of the pins switching  
The instruction cycle rate is 40 MH z (tCK = 25 ns) and  
VDD = 5.0 V.  
Exam ple System H old Tim e Calculation  
T o determine the data output hold time in a particular system,  
first calculate tDECAY using the equation given above. Choose  
V to be the difference between the ADSP-2106x’s output  
voltage and the input threshold for the device requiring the hold  
time. A typical V will be 0.4 V. CL is the total bus capacitance  
(per data line), and IL is the total leakage or three-state current  
REV. A  
–37–  
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