AD14060/AD14060L
Ther m al Char acter istics
Therm al Conductivity
T he AD14060/AD14060L is packaged in a 308-lead ceramic
quad flatpack (CQFP). T he package is optimized for thermal
conduction through the core (base of the package) down to the
mounting surface. T he AD14060/AD14060L is specified for a
case temperature (TCASE). Design of the mounting surface and
attachment material should be such that TCASE is not exceeded.
Therm al Conductivity
W/cm ؇C
Material
Ceramic
Kovar
T ungsten
T hermoplastic
Silicon
0.18
0.14
1.78
0.03
1.45
θJC = 0.36°C/W
Ther m al Cr oss-Section
T he data below, together with the detailed mechanical drawings
at the end of the data sheet, allows for constructing simple ther-
mal models for further analysis within targeted systems. T he top
layer of the package, where the die are mounted, is a metal VDD
layer. T he approximate metal area coverage from the metal
planes and routing layers is estimated below.
Metal Coverage P er Layer
P ercent Metal
(1 Mil Thick)
Layer
VDD
88
16
14
91
15
13
95
SIG2
SIG3
GND
SIG4
SIG5
BASE
KOVAR LID
0.015 MILS
KOVAR SEAL RING
HEIGHT = 50 MILS
SURFACE
SILICON DIE
19 MILS
CERAMIC LAYER 28 MILS
THERMOPLASTIC
THICKNESS 5 MILS
CERAMIC LAYER 6 MILS
CERAMIC LAYER 6 MILS
V
DD
CERAMIC LAYER 10 MILS
CERAMIC LAYER 4 MILS
CERAMIC LAYER 10 MILS
SIG2
SIG3
GND
CERAMIC LAYER 10 MILS
CERAMIC LAYER 4 MILS
CERAMIC LAYER 10 MILS
CERAMIC LAYER 4 MILS
SIG4
SIG5
BASE
REV. A
–41–
ADI [ ADI ]
