PLUS
ProASIC
Flash Family FPGAs
the maximum allowable temperature on the active
surface of the IC and is 110° C. P is defined as:
Package Thermal Characteristics
The ProASICPLUS family is available in several package
types with a range of pin counts. Actel has selected
packages based on high pin count, reliability factors, and
superior thermal characteristics.
TJ – TA
P = ------------------
Θja
EQ 1-4
Thermal resistance defines the ability of a package to
conduct heat away from the silicon, through the
package to the surrounding air. Junction-to-ambient
thermal resistance is measured in degrees Celsius/Watt
Θ
is a function of the rate (in linear feet per minute
ja
(lfpm)) of airflow in contact with the package. When the
estimated power consumption exceeds the maximum
allowed power, other means of cooling, such as
increasing the airflow rate, must be used. The maximum
power dissipation allowed for a Military temperature
and is represented as Theta ja (Θ ). The lower the
ja
thermal resistance, the more efficiently a package will
dissipate heat.
device is specified as a function of Θ . The absolute
maximum junction temperature is 150°C.
jc
A package’s maximum allowed power (P) is a function of
maximum junction temperature (TJ), maximum ambient
operating temperature (TA), and junction-to-ambient
The calculation of the absolute maximum power
dissipation allowed for
application is illustrated in the following example for a
456-pin PBGA package:
a
Military temperature
thermal resistance Θ . Maximum junction temperature is
ja
Max. junction temp. (°C) – Max. case temp. (°C) 150°C – 125°C
------------------------------------------------------------------------------------------------------------------------ -------------------------------------
Maximum Power Allowed =
=
= 8.333W
θjc(°C/W)
3.0°C/W
EQ 1-5
Table 1-15 • Package Thermal Characteristics
θja
1.0 m/s
2.5 m/s
Plastic Packages
Pin Count
θjc
14.0
11.0
8.0
3.8
3.0
3.8
3.8
3.2
3.2
3.2
2.4
1.8
2.0
2.0
6.5
Still Air
33.5
33.5
26.1
16.2
15.6
26.9
26.6
18.0
20.5
16.4
13.6
12.0
22.0
17.9
8.9
200 ft./min.
500 ft./min.
Units
Thin Quad Flat Pack (TQFP)
Thin Quad Flat Pack (TQFP)
Plastic Quad Flat Pack (PQFP)1
PQFP with Heat spreader2
100
144
208
208
456
144
256
484
484
676
896
1152
208
352
624
27.4
28.0
22.5
13.3
12.5
22.9
22.8
14.7
17.0
13.0
10.4
8.9
25.0
25.7
20.8
11.9
11.6
21.5
21.5
13.6
15.9
12.0
9.4
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Plastic Ball Grid Array (PBGA)
Fine Pitch Ball Grid Array (FBGA)
Fine Pitch Ball Grid Array (FBGA)
Fine Pitch Ball Grid Array (FBGA)3
Fine Pitch Ball Grid Array (FBGA)4
Fine Pitch Ball Grid Array (FBGA)
Fine Pitch Ball Grid Array (FBGA)
Fine Pitch Ball Grid Array (FBGA)
Ceramic Quad Flat Pack (CQFP)
Ceramic Quad Flat Pack (CQFP)
Ceramic Column Grid Array (CCGA/LGA)
Notes:
7.9
19.8
16.1
8.5
18.0
14.7
8.0
1. Valid for the following devices irrespective of temperature grade: APA075, APA150, and APA300
2. Valid for the following devices irrespective of temperature grade: APA450, APA600, APA750, and APA1000
3. Depopulated Array
4. Full array
v5.2
1-29
ACTEL [ Actel Corporation ]
